Inventor · disambiguated record
Leilei Zhang
Also filed as: ZHANG LEILEI
32 granted patents·22 pending applications·135 citations·filing 2001–2025
96Inventor score
Top patents by PatentIndex Score
54 records- 0196US11462461B2System in package for lower z height and reworkable component assemblyAPPLE INC·Filed 2020·Granted Oct 4, 2022·4 cites·15 claims
- 0295US10602612B1Vertical module and perpendicular pin array interconnect for stacked circuit board structureAPPLE INC·Filed 2019·Granted Mar 24, 2020·17 cites·16 claims
- 0392US9385098B2Variable-size solder bump structures for integrated circuit packagingNVIDIA CORP·Filed 2012·Granted Jul 5, 2016·17 cites·15 claims
- 0490US7388284B1Integrated circuit package and method of attaching a lid to a substrate of an integrated circuitXILINX INC·Filed 2005·Granted Jun 17, 2008·20 cites·9 claims
- 0587US7994631B1Substrate for an integrated circuit package and a method of forming a substrateXILINX INC·Filed 2009·Granted Aug 9, 2011·15 cites·20 claims
- 0679US7241640B1Solder ball assembly for a semiconductor device and method of fabricating sameXILINX INC·Filed 2005·Granted Jul 10, 2007·7 cites·14 claims
- 0777US9082674B2Microelectronic package with stress-tolerant solder bump patternNVIDIA CORP·Filed 2013·Granted Jul 14, 2015·4 cites·20 claims
- 0876US12041728B2Selective soldering with photonic soldering technologyAPPLE INC·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 0972US9530714B2Low-profile chip package with modified heat spreaderNVIDIA CORP·Filed 2012·Granted Dec 27, 2016·3 cites·27 claims
- 1072US7790510B1Metal lid with improved adhesion to package substrateXILINX INC·Filed 2008·Granted Sep 7, 2010·4 cites·16 claims
- 1171US9478482B2Offset integrated circuit packaging interconnectsNVIDIA CORP·Filed 2012·Granted Oct 25, 2016·3 cites·11 claims
- 1270US9716051B2Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarityNVIDIA CORP·Filed 2012·Granted Jul 25, 2017·2 cites·20 claims
- 1369US7545028B2Solder ball assembly for a semiconductor device and method of fabricating sameXILINX INC·Filed 2007·Granted Jun 9, 2009·3 cites·12 claims
- 1468US8063656B1Method of enabling a circuit board analysisUBALDO PEDRO R·Filed 2009·Granted Nov 22, 2011·6 cites·20 claims
- 1565US9368422B2Absorbing excess under-fill flow with a solder trenchNVIDIA CORP·Filed 2012·Granted Jun 14, 2016·2 cites·15 claims
- 1664US6744131B1Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidityXILINX INC·Filed 2003·Granted Jun 1, 2004·12 cites·42 claims
- 1763US7342298B1Metal lid with improved adhesion to package substrateXILINX INC·Filed 2004·Granted Mar 11, 2008·9 cites·20 claims
- 1863US2025195932A1Self-healing firefighting foam concentrates and firefighting foam compositions for class a and class b firesPERIMETER SOLUTIONS LP·Filed 2024·Application pending·0 cites
- 1963US2025121236A1Firefighting foams containing one or more surfactants and one or more additional componentsPERIMETER SOLUTIONS LP·Filed 2024·Application pending·0 cites
- 2061US9831189B2Integrated circuit package with a conductive grid formed in a packaging substrateNVIDIA CORP·Filed 2013·Granted Nov 28, 2017·1 cites·12 claims
- 2161US8143532B2Barrier layer to prevent conductive anodic filamentsZHANG LEILEI·Filed 2009·Granted Mar 27, 2012·2 cites·15 claims
- 2260US7807501B1Integrated circuit package and apparatus and method of producing an integrated circuit packageXILINX INC·Filed 2009·Granted Oct 5, 2010·1 cites·19 claims
- 2358US12040262B2Flex board and flexible moduleAPPLE INC·Filed 2021·Granted Jul 16, 2024·0 cites·16 claims
- 2458US2023310918A1Fluorine-free firefighting foams for use in sprinklersPERIMETER SOLUTIONS LP·Filed 2023·Application pending·0 cites
- 2558US2024075331A1Nanoparticle stabilized firefighting foamsPERIMETER SOLUTIONS LP·Filed 2023·Application pending·0 cites
- 2658US2025319341A1Polyethylene (pei) foam enhancers for firefighting foam compositions for class a and class b firesPERIMETER SOLUTIONS LP·Filed 2025·Application pending·0 cites
- 2757US8410604B2Lead-free structures in a semiconductor deviceYIP LAURENE·Filed 2010·Granted Apr 2, 2013·2 cites·18 claims
- 2857US2023271046A1Fluorine-free firefighting foam concentrates and firefighting foam compositionsPERIMETER SOLUTIONS LP·Filed 2023·Application pending·0 cites
- 2956US2024080970A1Electronic circuit packagesAPPLE INC·Filed 2023·Application pending·0 cites
- 3055US9368183B2Method for forming an integrated circuit packageNVIDIA CORP·Filed 2013·Granted Jun 14, 2016·0 cites·10 claims
- 3155US2025053281A1Control method of display window, electronic apparatus and storage mediumBEIJING XIAOMI MOBILE SOFTWARE CO LTD·Filed 2024·Application pending·0 cites
- 3252US2025303210A1Fluorine free firefighting foam compositions for low temperature applicationsPERIMETER SOLUTIONS LP·Filed 2025·Application pending·0 cites
- 3352US2023099638A1System and method for temperature sensing using thermopile integrated with rigid printed circuit boardAPPLE INC·Filed 2022·Application pending·0 cites
- 3450US11550975B2Methods and systems for predicting interfacial tension of reservoir fluids using downhole fluid measurementsSCHLUMBERGER TECHNOLOGY CORP·Filed 2020·Granted Jan 10, 2023·0 cites·26 claims
- 3550US10219387B2Process for manufacturing a printed circuit board having high density microvias formed in a thick substrateNVIDIA CORP·Filed 2013·Granted Feb 26, 2019·0 cites·22 claims
- 3648US9502355B2Bottom package having routing paths connected to top package and method of manufacturing the sameNVIDIA CORP·Filed 2014·Granted Nov 22, 2016·0 cites·29 claims
- 3747US9059054B1Integrated circuit package having improved coplanarityNVIDIA CORP·Filed 2014·Granted Jun 16, 2015·0 cites·10 claims
- 3847US7821132B2Contact pad and method of forming a contact pad for an integrated circuitXILINX INC·Filed 2007·Granted Oct 26, 2010·0 cites·17 claims
- 3947US7652369B1Integrated circuit package and apparatus and method of producing an integrated circuit packageXILINX INC·Filed 2005·Granted Jan 26, 2010·0 cites·10 claims
- 4044US9760132B2Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive padNVIDIA CORP·Filed 2013·Granted Sep 12, 2017·0 cites·30 claims
- 4144US9368439B2Substrate build up layer to achieve both finer design rule and better package coplanarityNVIDIA CORP·Filed 2012·Granted Jun 14, 2016·0 cites·20 claims
- 4244US2015216066A1Integrated circuit package having improved coplanarityNVIDIA CORP·Filed 2014·Application pending·0 cites
- 4343US2014362550A1Selective wetting process to increase solder joint standoffNVIDIA CORP·Filed 2013·Application pending·0 cites
- 4442US2019215914A1Drawer-type microwave oven, and door opening and closing control method thereforGUANGDONG MIDEA KITCHEN APPLIANCES MFG CO LTD·Filed 2019·Application pending·0 cites
- 4541US2021137381A1Electrode unit for measuring electrophysiological signalsZHANG WENZAN·Filed 2019·Application pending·0 cites
- 4640US2014117527A1Reduced integrated circuit package lid heightNVIDIA CORP·Filed 2012·Application pending·0 cites
- 4739US2014124254A1Non-solder mask defined copper pad and embedded copper pad to reduce packaging system heightNVIDIA CORP·Filed 2012·Application pending·0 cites
- 4838US2021043597A1Selective Soldering with Photonic Soldering TechnologyAPPLE INC·Filed 2020·Application pending·0 cites
- 4937US9087830B2System, method, and computer program product for affixing a post to a substrate padZHANG LEILEI·Filed 2012·Granted Jul 21, 2015·0 cites·13 claims
- 5037US2003089977A1Package enclosing multiple packaged chipsXILINX INC·Filed 2001·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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