Inventor · disambiguated record
Chao-Hsiang Yang
Also filed as: YANG CHAO · YANG CHAO-HSIANG
27 granted patents·4 pending applications·2,062 citations·filing 2002–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD14TAIWAN SEMICONDUCTOR MFG10ABILITY OPTO ELECTRONICS TECHNOLOGY CO LTD3CHEN CHUN-HONG1LIAO KUO-YU1
Top patents by PatentIndex Score
31 records- 0199US9372206B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 21, 2016·1.8k cites·20 claims
- 0298US10741537B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 11, 2020·36 cites·20 claims
- 0398US10663512B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·8 cites·14 claims
- 0498US10175294B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·14 cites·20 claims
- 0597US9618572B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 11, 2017·9 cites·20 claims
- 0697US9116203B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 25, 2015·13 cites·20 claims
- 0797US8797057B2Testing of semiconductor chips with microbumpsWU WEI-CHENG·Filed 2011·Granted Aug 5, 2014·17 cites·20 claims
- 0896US11169207B2Testing of semiconductor chips with microbumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 9, 2021·3 cites·20 claims
- 0994US10483174B1Integrated circuit component and package structure having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·7 cites·13 claims
- 1094US7456507B2Die seal structure for reducing stress induced during die saw processTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Nov 25, 2008·32 cites·12 claims
- 1191US11335672B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·20 claims
- 1285US12469753B2Integrated circuit component and package structure having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 11, 2025·0 cites·20 claims
- 1385US12322742B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 1485US6867441B1Metal fuse structure for saving layout areaTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 15, 2005·48 cites·21 claims
- 1585US2025266417A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1681US6835642B2Method of forming a metal fuse on semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 28, 2004·32 cites·41 claims
- 1780US7397106B2Laser fuse with efficient heat dissipationTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jul 8, 2008·9 cites·14 claims
- 1880US7009222B2Protective metal structure and method to protect low-K dielectric layer during fuse blow processTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 7, 2006·28 cites·10 claims
- 1979US11869819B2Integrated circuit component and package structure having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 2079US11855066B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2177US8576502B2Miniaturized lens assemblyCHEN CHUN-HONG·Filed 2012·Granted Nov 5, 2013·4 cites·8 claims
- 2274US11450579B2Integrated circuit component and package structure having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 20, 2022·0 cites·20 claims
- 2371US6639420B1Common probe card for flip-chip devicesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Oct 28, 2003·17 cites·6 claims
- 2470US9097860B2Lens assemblyABILITY OPTO ELECTRONICS TECHNOLOGY CO LTD·Filed 2013·Granted Aug 4, 2015·3 cites·7 claims
- 2565US10957610B2Integrated circuit component and package structure having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 2662US8049323B2Chip holder with wafer level redistribution layerTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 1, 2011·2 cites·15 claims
- 2748US9001437B2Imaging lens assemblyABILITY OPTO ELECTRONICS TECHNOLOGY CO LTD·Filed 2013·Granted Apr 7, 2015·0 cites·6 claims
- 2846US2014376111A1Wide-angle imaging lens assembly with three lensesABILITY OPTO ELECTRONICS TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2940USD996501SCameraSIEMENS HEALTHCARE GMBH·Filed 2021·Granted Aug 22, 2023·0 cites·1 claims
- 3040US2014043697A1Imaging LensLIAO KUO-YU·Filed 2013·Application pending·0 cites
- 3138US2005205965A1Semiconductor device having a fuse including an aluminum layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →