Inventor · disambiguated record

Hung-Ju Chung

Also filed as: CHUNG HUNG-JU

1 granted patent·1 citations·filing 2007–2007

16Inventor score

Technology areasH10W

Files withCHEN KUANG-HSIUNG1

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1 record

0145US8058725B2Package structure and package substrate thereofCHEN KUANG-HSIUNG·Filed 2007·Granted Nov 15, 2011·1 cites·16 claims

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