Inventor · disambiguated record
Markus Schwerd
Also filed as: SCHWERD MARKUS
11 granted patents·2 pending applications·118 citations·filing 2001–2012
90Inventor score
Top patents by PatentIndex Score
13 records- 0195US7619309B2Integrated connection arrangementsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Nov 17, 2009·49 cites·19 claims
- 0288US8367514B2Integrated circuit with capacitor and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2010·Granted Feb 5, 2013·9 cites·4 claims
- 0376US7667256B2Integrated circuit arrangement having a plurality of conductive structure levels and capacitor, and a method for producing the integrated circuit arrangementINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 23, 2010·8 cites·17 claims
- 0470US7692266B2Integrated circuit with capacitor and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 6, 2010·3 cites·14 claims
- 0568US6958509B2Integrated semiconductor product comprising a metal-insulator-metal capacitorINFINEON TECHNOLOGIES AG·Filed 2004·Granted Oct 25, 2005·15 cites·14 claims
- 0667US7964494B2Integrated connection arrangementsINFINEON TECHNOLOGIES AG·Filed 2009·Granted Jun 21, 2011·3 cites·4 claims
- 0767US7656037B2Integrated circuit with improved component interconnectionsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 2, 2010·4 cites·19 claims
- 0865US9269669B2Process for producing a multifunctional dielectric layer on a substrateHELNEDER JOHANN·Filed 2012·Granted Feb 23, 2016·2 cites·18 claims
- 0965US6940720B2Integrated circuit having a thermally shielded electric resistor traceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 6, 2005·12 cites·16 claims
- 1064US6774425B2Metal-insulator-metal capacitor and a method for producing sameINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 10, 2004·12 cites·16 claims
- 1149US8258628B2System and method for integrated circuit arrangement having a plurality of conductive structure levelsHOMMEL MARTINA·Filed 2006·Granted Sep 4, 2012·1 cites·19 claims
- 1243US2006222760A1Process for producing a multifunctional dielectric layer on a substrateHELNEDER JOHANN·Filed 2006·Application pending·0 cites
- 1334US2003040161A1Method of producing an integrated component with a metal-insulator-metal capacitorFiled 2002·Application pending·0 cites
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