Inventor · disambiguated record
Edmund M. Sikorski
Also filed as: SIKORSKI EDMUND M
6 granted patents·71 citations·filing 2000–2014
82Inventor score
Technology areasH10P
Top patents by PatentIndex Score
6 records- 0189US6518136B2Sacrificial polysilicon sidewall process and rapid thermal spike annealing for advance CMOS fabricationIBM·Filed 2000·Granted Feb 11, 2003·42 cites·8 claims
- 0285US7820552B2Advanced high-k gate stack patterning and structure containing a patterned high-k gate stackIBM·Filed 2007·Granted Oct 26, 2010·10 cites·31 claims
- 0382US8652969B2High aspect ratio and reduced undercut trench etch process for a semiconductor substrateFULLER NICHOLAS C M·Filed 2011·Granted Feb 18, 2014·6 cites·25 claims
- 0473US9711365B2Etch rate enhancement for a silicon etch process through etch chamber pretreatmentIBM·Filed 2014·Granted Jul 18, 2017·3 cites·19 claims
- 0570US8928124B2High aspect ratio and reduced undercut trench etch process for a semiconductor substrateIBM·Filed 2013·Granted Jan 6, 2015·2 cites·14 claims
- 0664US6743686B2Sacrificial polysilicon sidewall process and rapid thermal spike annealing for advance CMOS fabricationIBM·Filed 2002·Granted Jun 1, 2004·8 cites·11 claims
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