Inventor · disambiguated record
Boin Noh
Also filed as: NOH BOIN
4 granted patents·4 pending applications·8 citations·filing 2013–2024
63Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0174US9142498B2Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnectionsNOH BOIN·Filed 2013·Granted Sep 22, 2015·6 cites·18 claims
- 0266US9601466B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 21, 2017·2 cites·15 claims
- 0358US2025022758A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0457US12354980B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 0557US2024304504A1Semiconductor package including a test bumpSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0649US2023148222A1Interposer structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0745US2023030589A1Semiconductor package including chip connection structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0842US11164821B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 2, 2021·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →