Inventor · disambiguated record

Yi-Ying Kuo

Also filed as: KUO YI-YING

1 granted patent·3 citations·filing 2016–2016

21Inventor score

Technology areasH10W

Files withXINTEC INC1

Top patents by PatentIndex Score

1 record

0173US9799778B2Chip package having a trench exposed protruding conductive padXINTEC INC·Filed 2016·Granted Oct 24, 2017·3 cites·21 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →