Inventor · disambiguated record
Toshiko Nakagawa
Also filed as: NAKAGAWA TOSHIKO
10 granted patents·369 citations·filing 1994–2004
91Inventor score
Files withMEC CO LTD10
Top patents by PatentIndex Score
10 records- 0190US5532094AComposition for treating copper or copper alloy surfacesMEC CO LTD·Filed 1995·Granted Jul 2, 1996·96 cites·6 claims
- 0289US5965036AMicroetching composition for copper or copper alloyMEC CO LTD·Filed 1997·Granted Oct 12, 1999·82 cites·15 claims
- 0384US5807493AMicroetching method for copper or copper alloyMEC CO LTD·Filed 1996·Granted Sep 15, 1998·59 cites·5 claims
- 0483US5496590AComposition for treating copper and copper alloy surfaces and method for the surface treatmentMEC CO LTD·Filed 1994·Granted Mar 5, 1996·32 cites·3 claims
- 0577US5700389AEtching solution for copper or copper alloyMEC CO LTD·Filed 1995·Granted Dec 23, 1997·43 cites·13 claims
- 0665US6733886B2Laminate and method of manufacturing the sameMEC CO LTD·Filed 2002·Granted May 11, 2004·9 cites·14 claims
- 0756US5885476AComposition for microetching copper or copper alloyMEC CO LTD·Filed 1997·Granted Mar 23, 1999·23 cites·8 claims
- 0852US7029761B2Bonding layer for bonding resin on copper surfaceMEC CO LTD·Filed 2004·Granted Apr 18, 2006·5 cites·7 claims
- 0952US6106899AMethod for surface treatment of copper or copper alloysMEC CO LTD·Filed 1998·Granted Aug 22, 2000·17 cites·15 claims
- 1043US7156904B2Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained therebyMEC CO LTD·Filed 2004·Granted Jan 2, 2007·3 cites·18 claims
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