Inventor · disambiguated record
Takenori Takiguchi
Also filed as: TAKIGUCHI TAKENORI
5 granted patents·1 pending application·1 citations·filing 2014–2019
60Inventor score
Files withMITSUBISHI GAS CHEMICAL CO6
Top patents by PatentIndex Score
6 records- 0162US10808103B2Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layerMITSUBISHI GAS CHEMICAL CO·Filed 2017·Granted Oct 20, 2020·1 cites·19 claims
- 0247US9905328B2Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the sameMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Feb 27, 2018·0 cites·16 claims
- 0345US11935803B2Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Mar 19, 2024·0 cites·27 claims
- 0434US11924979B2Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Granted Mar 5, 2024·0 cites·26 claims
- 0534US11053382B2Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2017·Granted Jul 6, 2021·0 cites·22 claims
- 0634US2021147680A1Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor deviceMITSUBISHI GAS CHEMICAL CO·Filed 2019·Application pending·0 cites
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