Inventor · disambiguated record

Chia-Hsiang Yuan

Also filed as: YUAN CHIA-HSIANG

1 granted patent·2 citations·filing 2015–2015

19Inventor score

Technology areasH10W

Files withPOWERTECH TECHNOLOGY INC1

Top patents by PatentIndex Score

1 record

0168US9673178B2Method of forming package structure with dummy pads for bondingPOWERTECH TECHNOLOGY INC·Filed 2015·Granted Jun 6, 2017·2 cites·7 claims

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Chia-Hsiang Yuan — Patent Inventor | PatentIndex