Inventor · disambiguated record
Satoshi Kurokawa
Also filed as: KUROKAWA SATOSHI
8 granted patents·2 pending applications·112 citations·filing 1988–2015
85Inventor score
Top patents by PatentIndex Score
10 records- 0188US9443800B2Package substrate and method for manufacturing package substrateIBIDEN CO LTD·Filed 2015·Granted Sep 13, 2016·7 cites·20 claims
- 0288US9287250B2Package substrateIBIDEN CO LTD·Filed 2015·Granted Mar 15, 2016·7 cites·20 claims
- 0380US9763319B2Package substrate and method for manufacturing package substrateIBIDEN CO LTD·Filed 2015·Granted Sep 12, 2017·4 cites·20 claims
- 0478US9263784B2Package substrateIBIDEN CO LTD·Filed 2015·Granted Feb 16, 2016·3 cites·20 claims
- 0576US9326377B2Printed wiring boardIBIDEN CO LTD·Filed 2013·Granted Apr 26, 2016·3 cites·20 claims
- 0673US5835916ADocument preparing apparatus capable of relocating cells forming a table and resetting cell sizeSANYO ELECTRIC CO·Filed 1996·Granted Nov 10, 1998·83 cites·15 claims
- 0749US8743557B2Printed wiring boardMANO YASUHIKO·Filed 2012·Granted Jun 3, 2014·0 cites·20 claims
- 0844US2014374150A1Package substrate and method for manufacturing package substrateIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 0943US4876306AProcess for preparing a thermoplastic resinMITSUBISHI RAYON CO·Filed 1988·Granted Oct 24, 1989·5 cites·6 claims
- 1041US2012152606A1Printed wiring boardKUROKAWA SATOSHI·Filed 2011·Application pending·0 cites
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