Inventor · disambiguated record
Aiza Marie Agudon
Also filed as: AGUDON AIZA MARIE
9 granted patents·1 pending application·12 citations·filing 2015–2021
82Inventor score
Files withST MICROELECTRONICS INC10
Top patents by PatentIndex Score
10 records- 0189US10109563B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2017·Granted Oct 23, 2018·6 cites·25 claims
- 0280US10615104B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2018·Granted Apr 7, 2020·2 cites·17 claims
- 0380US10535588B2Die with metallized sidewall and method of manufacturingST MICROELECTRONICS INC·Filed 2017·Granted Jan 14, 2020·3 cites·19 claims
- 0479US10957634B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2020·Granted Mar 23, 2021·1 cites·19 claims
- 0571US11552007B2Modified leadframe design with adhesive overflow recessesST MICROELECTRONICS INC·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 0669US12074100B2Flat no-lead package with surface mounted structureST MICROELECTRONICS INC·Filed 2020·Granted Aug 27, 2024·0 cites·20 claims
- 0768US12159820B2Flat no-lead package with surface mounted structureST MICROELECTRONICS INC·Filed 2020·Granted Dec 3, 2024·0 cites·20 claims
- 0854US10892212B2Flat no-lead package with surface mounted structureST MICROELECTRONICS INC·Filed 2017·Granted Jan 12, 2021·0 cites·15 claims
- 0938US9761538B1Method for making a shielded integrated circuit (IC) package with an electrically conductive polymer layerST MICROELECTRONICS INC·Filed 2016·Granted Sep 12, 2017·0 cites·30 claims
- 1028US2017084490A1Method for making ic with stepped sidewall and related ic devicesST MICROELECTRONICS INC·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →