Inventor · disambiguated record
Tianhua Yu
Also filed as: YU TIANHUA
4 granted patents·1 pending application·38 citations·filing 2014–2024
67Inventor score
Files withLAM RES CORP5
Top patents by PatentIndex Score
5 records- 0195US9349637B2Method for void-free cobalt gap fillLAM RES CORP·Filed 2014·Granted May 24, 2016·37 cites·18 claims
- 0273US11972952B2Atomic layer deposition on 3D NAND structuresLAM RES CORP·Filed 2019·Granted Apr 30, 2024·1 cites·16 claims
- 0371US2024266177A1Atomic layer deposition on 3d nand structuresLAM RES CORP·Filed 2024·Application pending·0 cites
- 0448US12077858B2Tungsten depositionLAM RES CORP·Filed 2020·Granted Sep 3, 2024·0 cites·21 claims
- 0546US12060639B2Rapid flush purging during atomic layer depositionLAM RES CORP·Filed 2020·Granted Aug 13, 2024·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →