Inventor · disambiguated record
Masataka Hoshino
Also filed as: HOSHINO MASATAKA
18 granted patents·287 citations·filing 1994–2013
95Inventor score
Top patents by PatentIndex Score
18 records- 0195US7094701B2Manufacturing method of semiconductor deviceNEC CORP·Filed 2005·Granted Aug 22, 2006·55 cites·12 claims
- 0291US9418940B2Structures and methods for stack type semiconductor packagingHOSHINO MASATAKA·Filed 2008·Granted Aug 16, 2016·35 cites·20 claims
- 0391US7605457B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2006·Granted Oct 20, 2009·18 cites·8 claims
- 0487US7732925B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Jun 8, 2010·14 cites·8 claims
- 0584US7786587B2Semiconductor device and method for manufacturing thereofSPANSION LLC·Filed 2008·Granted Aug 31, 2010·13 cites·10 claims
- 0684US6734084B1Method of manufacturing a semiconductor device with recesses using anodic oxideMITSUBISHI ELECTRIC CORP·Filed 2003·Granted May 11, 2004·48 cites·5 claims
- 0782US8030179B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2009·Granted Oct 4, 2011·8 cites·9 claims
- 0877US8637986B2Semiconductor device and method for manufacturing thereofMASUDA NAOMI·Filed 2008·Granted Jan 28, 2014·7 cites·5 claims
- 0977US6707157B2Three dimensional semiconductor integrated circuit device having a piercing electrodeFUJITSU LTD·Filed 2001·Granted Mar 16, 2004·26 cites·8 claims
- 1076US7224859B2Opto-electronic integrated circuit device, opto-electronic integrated circuit system and transmission methodSHARP KK·Filed 2005·Granted May 29, 2007·6 cites·6 claims
- 1171US7750478B2Semiconductor device with via hole of uneven widthSANYO ELECTRIC CO·Filed 2007·Granted Jul 6, 2010·4 cites·10 claims
- 1262US9437573B2Semiconductor device and method for manufacturing thereofCYPRESS SEMICONDUCTOR CORP·Filed 2013·Granted Sep 6, 2016·1 cites·4 claims
- 1362US9293441B2Semiconductor device and method of manufacturing the sameHOSHINO MASATAKA·Filed 2011·Granted Mar 22, 2016·1 cites·11 claims
- 1458US6440844B1Semiconductor device with copper wiring and its manufacture methodFUJITSU LTD·Filed 1998·Granted Aug 27, 2002·27 cites·21 claims
- 1549US8367466B2Manufacturing stacked semiconductor deviceSPANSION LLC·Filed 2008·Granted Feb 5, 2013·0 cites·20 claims
- 1645US5589425AProcess of selective area chemical vapor deposition of metal filmsFUJITSU LTD·Filed 1994·Granted Dec 31, 1996·15 cites·5 claims
- 1744US8148771B2Semiconductor device and method to manufacture thereofHOSHINO MASATAKA·Filed 2010·Granted Apr 3, 2012·0 cites·16 claims
- 1839US5491005AGold thin film vapor growing methodFUJITSU LTD·Filed 1994·Granted Feb 13, 1996·9 cites·15 claims
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