Inventor · disambiguated record

Nageswara Rao Bonda

Also filed as: BONDA NAGESWARA RAO

1 granted patent·21 citations·filing 2010–2010

40Inventor score

Technology areasH10W

Files withGONG ZHIWEI1

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1 record

0190US8329509B2Packaging process to create wettable lead flank during board assemblyGONG ZHIWEI·Filed 2010·Granted Dec 11, 2012·21 cites·20 claims

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