Inventor · disambiguated record
Kuo-Chih Lai
Also filed as: LAI KUO-CHIH
45 granted patents·12 pending applications·131 citations·filing 1999–2022
97Inventor score
Top patents by PatentIndex Score
57 records- 0195US9659937B2Semiconductor process of forming metal gates with different threshold voltages and semiconductor structure thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 23, 2017·14 cites·20 claims
- 0293US9679813B2Semiconductor structure and process for forming plug including layer with pulled back sidewall partUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 13, 2017·9 cites·8 claims
- 0392US8766319B2Semiconductor device with ultra thin silicide layerLAI KUO-CHIH·Filed 2012·Granted Jul 1, 2014·16 cites·2 claims
- 0489US9640482B1Semiconductor device with a contact plug and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 2, 2017·6 cites·20 claims
- 0589US7378343B2Dual damascence process utilizing teos-based silicon oxide cap layer having reduced carbon contentUNITED MICROELECTRONICS CORP·Filed 2005·Granted May 27, 2008·20 cites·20 claims
- 0688US10074725B1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 11, 2018·5 cites·17 claims
- 0786US10756128B2Integrated circuit device and method of fabricating integrated circuitUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 25, 2020·5 cites·20 claims
- 0886US8067281B1Method of fabricating complementary metal-oxide-semiconductor (CMOS) DeviceCHEN YI-WEI·Filed 2010·Granted Nov 29, 2011·9 cites·15 claims
- 0982US8598033B1Method for forming a salicide layerUNITED MICROELECTRONICS CORP·Filed 2012·Granted Dec 3, 2013·6 cites·13 claims
- 1079US9728467B2Method for modulating work function of semiconductor device having metal gate structure by gas treatmentUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 8, 2017·3 cites·18 claims
- 1177US9755047B2Semiconductor process and semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 5, 2017·2 cites·3 claims
- 1270US8541303B2Method for fabricating MOS transistorLAI KUO-CHIH·Filed 2011·Granted Sep 24, 2013·2 cites·6 claims
- 1370US7947565B2Forming method of porous low-k layer and interconnect processUNITED MICROELECTRONICS CORP·Filed 2007·Granted May 24, 2011·4 cites·17 claims
- 1469US8350246B2Structure of porous low-k layer and interconnect structureUNITED MICROELECTRONICS CORP·Filed 2011·Granted Jan 8, 2013·2 cites·25 claims
- 1568US9966425B1Method for fabricating a MIM capacitorUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 8, 2018·1 cites·14 claims
- 1666US11424408B2ReRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 23, 2022·0 cites·7 claims
- 1766US8877635B2Method for fabricating MOS transistorUNITED MICROELECTRONICS CORP·Filed 2013·Granted Nov 4, 2014·1 cites·8 claims
- 1866US8815738B2Salicide processHSU CHIA-CHANG·Filed 2012·Granted Aug 26, 2014·3 cites·12 claims
- 1965US11856870B2MRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 26, 2023·0 cites·4 claims
- 2065US9478628B1Metal gate forming processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 25, 2016·1 cites·16 claims
- 2164US9570348B2Method of forming contact strucutreUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 14, 2017·1 cites·11 claims
- 2264US8163607B2Semiconductor device and method of making the sameCHEN YI-WEI·Filed 2010·Granted Apr 24, 2012·1 cites·8 claims
- 2362US7943512B2Method for fabricating metal silicideUNITED MICROELECTRONICS CORP·Filed 2007·Granted May 17, 2011·1 cites·14 claims
- 2461US12274087B2Field effect transistor and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 2561US12211888B2Method for forming a thin film resistor with improved thermal stabilityUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 28, 2025·0 cites·9 claims
- 2660US9318338B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted Apr 19, 2016·1 cites·10 claims
- 2757US11165019B2ReRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Nov 2, 2021·0 cites·9 claims
- 2857US10340350B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 2, 2019·0 cites·2 claims
- 2956US11139384B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 5, 2021·0 cites·8 claims
- 3055US10068797B2Semiconductor process for forming plugUNITED MICROELECTRONICS CORP·Filed 2017·Granted Sep 4, 2018·0 cites·12 claims
- 3155US8993390B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Mar 31, 2015·0 cites·16 claims
- 3254US8486790B2Manufacturing method for metal gateHUANG PO-CHENG·Filed 2011·Granted Jul 16, 2013·1 cites·13 claims
- 3353US9985110B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 29, 2018·0 cites·9 claims
- 3453US8344465B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2012·Granted Jan 1, 2013·0 cites·3 claims
- 3551US2009275211A1Fabrication method of porous low-k dielectric filmCHEN MEI-LING·Filed 2009·Application pending·0 cites
- 3649US6296554B1Non-circular workpiece carrierIND TECH RES INST·Filed 1999·Granted Oct 2, 2001·17 cites·17 claims
- 3747US10490643B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Nov 26, 2019·0 cites·10 claims
- 3847US10290710B2Semiconductor device and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 14, 2019·0 cites·19 claims
- 3946US8883650B2Method of removing oxidesLAI KUO-CHIH·Filed 2008·Granted Nov 11, 2014·0 cites·18 claims
- 4046US7803702B2Method for fabricating MOS transistorsUNITED MICROELECTRONICS CORP·Filed 2008·Granted Sep 28, 2010·0 cites·14 claims
- 4145US11404631B2MRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Aug 2, 2022·0 cites·7 claims
- 4245US7670438B2Method of removing particles from waferUNITED MICROELECTRONICS CORP·Filed 2007·Granted Mar 2, 2010·0 cites·20 claims
- 4344US9685316B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 20, 2017·0 cites·8 claims
- 4444US2007173070A1Porous low-k dielectric film and fabrication method thereofCHEN MEI-LING·Filed 2006·Application pending·0 cites
- 4544US2008166498A1Method of curing porous low-k layerUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 4643US9691704B1Semiconductor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 27, 2017·0 cites·15 claims
- 4743US8641828B2Cleaning method of semiconductor manufacturing processCHEN YI-WEI·Filed 2011·Granted Feb 4, 2014·0 cites·22 claims
- 4841US2007218214A1Method of improving adhesion property of dielectric layer and interconnect processLAI KUO-CHIH·Filed 2006·Application pending·0 cites
- 4939US9576803B2Method for tuning metal gate work function before contact formation in fin-shaped field effect transistor manufacturing processUNITED MICROELECTRONICS CORP·Filed 2015·Granted Feb 21, 2017·0 cites·9 claims
- 5039US2006281299A1Method of fabricating silicon carbide-capped copper damascene interconnectCHEN JEI-MING·Filed 2006·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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