Inventor
WIELAND MARCEL B
DE2 patents
Patents
2 patentsUS11907623B2Feb 20, 2024
Chip module structure and method and system for chip module design using chip-package co-optimization
GLOBALFOUNDRIES DRESDEN MOD 10 citations50
US11557421B2Jan 17, 2023
Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method
GLOBALFOUNDRIES DRESDEN MOD 10 citations43