Inventor · disambiguated record
Chi-Shih Chang
Also filed as: CHANG CHI S · CHANG CHI-SHIH
22 granted patents·1 pending application·1,127 citations·filing 1974–2013
97Inventor score
Top patents by PatentIndex Score
23 records- 0198US5191174AHigh density circuit board and method of making sameIBM·Filed 1990·Granted Mar 2, 1993·332 cites·21 claims
- 0297US5774340APlanar redistribution structure and printed wiring deviceIBM·Filed 1996·Granted Jun 30, 1998·271 cites·11 claims
- 0393US8810031B2Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2010·Granted Aug 19, 2014·27 cites·40 claims
- 0490US7667338B2Package with solder-filled via holes in molding layersLIN PAUL T·Filed 2007·Granted Feb 23, 2010·21 cites·25 claims
- 0590US5248262AHigh density connectorIBM·Filed 1992·Granted Sep 28, 1993·82 cites·47 claims
- 0687US4295149AMaster image chip organization technique or methodIBM·Filed 1978·Granted Oct 13, 1981·68 cites·6 claims
- 0786US6188305B1Transformer formed in conjunction with printed circuit boardIBM·Filed 1995·Granted Feb 13, 2001·50 cites·3 claims
- 0883US8164165B2Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2006·Granted Apr 24, 2012·10 cites·35 claims
- 0981US3961355ASemiconductor device having electrically insulating barriers for surface leakage sensitive devices and method of formingIBM·Filed 1974·Granted Jun 1, 1976·27 cites·6 claims
- 1078US9111774B2Wafer-to-wafer stack with supporting postIND TECH RES INST·Filed 2013·Granted Aug 18, 2015·3 cites·35 claims
- 1170US6000130AProcess for making planar redistribution structureIBM·Filed 1998·Granted Dec 14, 1999·33 cites·13 claims
- 1270US4249193ALSI Semiconductor device and fabrication thereofIBM·Filed 1978·Granted Feb 3, 1981·31 cites·27 claims
- 1367US5519633AMethod and apparatus for the cross-sectional design of multi-layer printed circuit boardsIBM·Filed 1993·Granted May 21, 1996·50 cites·8 claims
- 1461US5959348AConstruction of PBGA substrate for flip chip packingIBM·Filed 1997·Granted Sep 28, 1999·25 cites·5 claims
- 1560US5546321AMethod and apparatus for the cross-sectional design of multi-layer printed circuit boardsIBM·Filed 1995·Granted Aug 13, 1996·41 cites·2 claims
- 1659US7948072B2Wafer-to-wafer stackingIND TECH RES INST·Filed 2008·Granted May 24, 2011·1 cites·19 claims
- 1759US6829149B1Placement of sacrificial solder balls underneath the PBGA substrateIBM·Filed 1997·Granted Dec 7, 2004·17 cites·4 claims
- 1854US7227268B2Placement of sacrificial solder balls underneath the PBGA substrateIBM·Filed 2004·Granted Jun 5, 2007·3 cites·16 claims
- 1948US6353182B1Proper choice of the encapsulant volumetric CTE for different PGBA substratesIBM·Filed 1998·Granted Mar 5, 2002·14 cites·10 claims
- 2048US2012178212A1Wafer-to-wafer stack with supporting pedestalCHANG CHI-SHIH·Filed 2012·Application pending·0 cites
- 2146US7374811B2Probe pad structure in a ceramic space transformerSV PROBE PTE LTD·Filed 2006·Granted May 20, 2008·0 cites·11 claims
- 2246US6255599B1Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delaminationIBM·Filed 1997·Granted Jul 3, 2001·12 cites·20 claims
- 2334US5684392ASystem for extending operating time of a battery-operated electronic deviceIBM·Filed 1995·Granted Nov 4, 1997·9 cites·21 claims
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