Inventor · disambiguated record
Tyler Auvil
Also filed as: AUVIL TYLER · AUVIL TYLER J
2 granted patents·10 pending applications·1 citations·filing 2016–2023
30Inventor score
Files withDDP SPECIALTY ELECTRONIC MATERIALS US LLC9DOW GLOBAL TECHNOLOGIES LLC2DUPONT POLYMERS INC1
Top patents by PatentIndex Score
12 records- 0184US2023407154A1Blocked polyurethane tougheners for epoxy adhesivesDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2023·Application pending·0 cites
- 0274US11274236B2One-component toughened epoxy adhesives containing a mixture of latent curing agentsDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2018·Granted Mar 15, 2022·1 cites·7 claims
- 0374US2021371717A1Blocked polyurethane tougheners for epoxy adhesivesDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2021·Application pending·0 cites
- 0467US2025051606A1Two-component polyurethane adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2023·Application pending·0 cites
- 0563US2025368867A1Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2023·Application pending·0 cites
- 0663US2018163104A1Blocked polyurethane tougheners for epoxy adhesivesDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Application pending·0 cites
- 0760US2024199931A1One-component polyurethane adhesiveDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2021·Application pending·0 cites
- 0857US2025382510A1Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2023·Application pending·0 cites
- 0955US11820922B2Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2018·Granted Nov 21, 2023·0 cites·7 claims
- 1052US2023279276A1Bonding dissimilar materials using radio frequency wave curingDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2021·Application pending·0 cites
- 1148US2021331448A1Polymer metal hybrid laminatesDUPONT POLYMERS INC·Filed 2019·Application pending·0 cites
- 1243US2021230421A1Toughened epoxy compositionsDOW GLOBAL TECHNOLOGIES LLC·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →