Inventor · disambiguated record

Andrew J. Heidelberg

Also filed as: HEIDELBERG ANDREW J

1 granted patent·13 citations·filing 1998–1998

35Inventor score

Technology areasH10W

Files withMCMS INC1

Top patents by PatentIndex Score

1 record

0142US6229218B1Interconnect device and method for mating dissimilar electronic package footprintsMCMS INC·Filed 1998·Granted May 8, 2001·13 cites·2 claims

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