Inventor

PARK BYUNG-LYUL

KR104 patents

⚠️ This page may combine multiple inventors who share the name “PARK BYUNG-LYUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK BYUNG-LYUL

SAMSUNG ELECTRONICS CO LTD

Wafer-to-wafer bonding structure

Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate

Methods of fabricating a selectively deposited tungsten nitride layer and metal wiring using a tungsten nitride layer

Method for manufacturing a capacitor in a semiconductor device using selective tungsten nitride thin film

Method of fabricating multi-substrate semiconductor devices

Semiconductor devices

Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages

Method of manufacturing a capacitor and a capacitor electrode in semiconductor device

Method of manufacturing semiconductor package

Method for manufacturing a semiconductor device having a metal-insulator-metal capacitor and a damascene wiring layer structure

Method of fabricating semiconductor device including planarizing conductive layer using parameters of pattern density and depth of trenches

Audio output device and electronic device connected therewith

Multi-stacked device having TSV structure

Integrated circuit devices having through-silicon via structures and methods of manufacturing the same

Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure

Semiconductor devices and methods of fabricating the same

Semiconductor devices having through-vias and methods for fabricating the same

Semiconductor devices having through-vias and methods for fabricating the same

Semiconductor devices and methods of manufacturing the same

Semiconductor devices having hybrid stacking structures and methods of fabricating the same

Semiconductor devices having through-vias and methods for fabricating the same

Semiconductor devices

Semiconductor device having capacitor and method of manufacturing the same

Semiconductor package

Method for fabricating substrate structure and substrate structure fabricated by using the method

Wafer processing methods

Semiconductor devices including through-silicon via

Semiconductor integrated circuit, method for fabricating the same, and semiconductor package

Semiconductor device including through via structures and redistribution structures

LEE HO-JIN

Semiconductor device including conductive via with buffer layer at tapered portion of conductive via

Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devices

Semiconductor devices having conductive via structures and methods for fabricating the same

Semiconductor devices with through electrodes and methods of fabricating the same

PARK JAE-HWA

Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the same

Integrated circuit devices having through silicon via structures and methods of manufacturing the same

Integrated circuit device having through-silicon-via structure and method of manufacturing the integrated circuit device

PARK BYUNG-LYUL

Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structure

Integrated circuit having through silicon via structure with minimized deterioration

Methods of manufacturing a semiconductor device

KANG PIL-KYU

Buried-type optical input/output devices and methods of manufacturing the same

Semiconductor devices having optical transceiver

JUNG DEOK-YOUNG

Method of forming semiconductor device

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

PARK JIN-HO

Method of manufacturing a semiconductor device

Methods of manufacturing semiconductor devices

MOON KWANG-JIN

Semiconductor device and method of fabricating the same

KIM SU-KYOUNG

Integrated circuit device including through-silicon via structure having offset interface

HAN KYU-HEE

Semiconductor devices and methods of manufacturing the same

LEE DOSUN

Semiconductor devices including through silicon via electrodes and methods of fabricating the same

KIM TAEYEONG

Semiconductor devices having stacked structures and methods for fabricating the same