Inventor

MOON KWANG-JIN

KR68 patents

⚠️ This page may combine multiple inventors who share the name “MOON KWANG-JIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOON KWANG-JIN

SAMSUNG ELECTRONICS CO LTD

Wafer-to-wafer bonding structure

Method of forming metal layer used in the fabrication of semiconductor device

Method of forming a semiconductor device having contact using crack-protecting layer

Semiconductor device, semiconductor package and method of manufacturing the same

Method of manufacturing substrate structure

Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices

Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure

Methods of manufacturing semiconductor devices and semiconductor devices manufactured using such a method

Methods of forming cobalt layers for semiconductor devices

Methods for forming cobalt layers including introducing vaporized cobalt precursors and methods for manufacturing semiconductor devices using the same

Semiconductor devices and methods of manufacturing the same

Semiconductor package and method of fabricating the same

Method for fabricating substrate structure and substrate structure fabricated by using the method

Semiconductor integrated circuit, method for fabricating the same, and semiconductor package

Electrode connecting structures containing copper

Method for forming silicide contacts

Methods for forming a metal contact in a semiconductor device in which an ohmic layer is formed while forming a barrier metal layer

Integrated circuit devices having self-aligned contact structures

Method of cleaning a chemical vapor deposition chamber

Semiconductor device

Wafer bonding apparatus and wafer bonding system including the same

Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devices

Wafer bonding apparatus for directly bonding wafers and a wafer bonding system having the same

Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices

Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices

Semiconductor device

Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices

Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices

Semiconductor devices

Semiconductor devices

Methods of forming a metal layer using transition metal precursors

Semiconductor device including backside wiring structure with super via

Semiconductor device, semiconductor package and method of manufacturing the same

Semiconductor device having a through silicon via and methods of manufacturing the same

Integrated circuit device and method of manufacturing the same

Semiconductor chips and methods of manufacturing the same

Semiconductor device having a through silicon via and methods of manufacturing the same

Integrated circuit device and method of manufacturing the same

PARK JAE-HWA

Integrated circuit device including through-silicon via structure and decoupling capacitor and method of manufacturing the same

Integrated circuit devices having through silicon via structures and methods of manufacturing the same

Integrated circuit devices including a through-silicon via structure and methods of fabricating the same

Integrated circuit device having through-silicon-via structure and method of manufacturing the integrated circuit device

PARK BYUNG-LYUL

Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structure

Integrated circuit having through silicon via structure with minimized deterioration

Methods of manufacturing a semiconductor device

Semiconductor device and method of fabricating the same

MOON KWANG-JIN

Semiconductor device and method of fabricating the same

JUNG DEOK-YOUNG

Method of forming semiconductor device

KIM SU-KYOUNG

Integrated circuit device including through-silicon via structure having offset interface

JUNG EUN-JI

Method of forming buried gate electrode utilizing formation of conformal gate oxide and gate electrode layers