P

Inventor

PARK JAE-HWA

KR62 patents
⚠️ This page may combine multiple inventors who share the name “PARK JAE-HWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

16 patents
US9461007B2Oct 4, 2016

Wafer-to-wafer bonding structure

SAMSUNG ELECTRONICS CO LTD239 citations99
US9337125B2May 10, 2016

Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure

SAMSUNG ELECTRONICS CO LTD10 citations84
US9178039B2Nov 3, 2015

Semiconductor device

SAMSUNG ELECTRONICS CO LTD18 citations84
US7696552B2Apr 13, 2010

Semiconductor devices including high-k dielectric materials

SAMSUNG ELECTRONICS CO LTD12 citations84
US7534709B2May 19, 2009

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD12 citations82
US7371669B2May 13, 2008

Method of forming a gate of a semiconductor device

SAMSUNG ELECTRONICS CO LTD7 citations74
US9252141B2Feb 2, 2016

Semiconductor integrated circuit, method for fabricating the same, and semiconductor package

SAMSUNG ELECTRONICS CO LTD4 citations73
US7989333B2Aug 2, 2011

Methods of forming integrated circuit devices having anisotropically-oxidized nitride layers

SAMSUNG ELECTRONICS CO LTD2 citations63
US7875939B2Jan 25, 2011

Semiconductor device including an ohmic layer

SAMSUNG ELECTRONICS CO LTD2 citations63
US7759263B2Jul 20, 2010

Methods for fabricating improved gate dielectrics

SAMSUNG ELECTRONICS CO LTD5 citations63
US7550353B2Jun 23, 2009

Method of forming semiconductor device

SAMSUNG ELECTRONICS CO LTD6 citations63
US7544597B2Jun 9, 2009

Method of forming a semiconductor device including an ohmic layer

SAMSUNG ELECTRONICS CO LTD3 citations63
US7501673B2Mar 10, 2009

Semiconductor device multilayer structure, fabrication method for the same, semiconductor device having the same, and semiconductor device fabrication method

SAMSUNG ELECTRONICS CO LTD5 citations63
US7439176B2Oct 21, 2008

Semiconductor device multilayer structure, fabrication method for the same, semiconductor device having the same, and semiconductor device fabrication method

SAMSUNG ELECTRONICS CO LTD3 citations63
US9490216B2Nov 8, 2016

Semiconductor device and semiconductor package

SAMSUNG ELECTRONICS CO LTD0 citations52
US7989892B2Aug 2, 2011

Gate structure, and semiconductor device having a gate structure

SAMSUNG ELECTRONICS CO LTD0 citations52

HYUNDAI MOTOR CO LTD

12 patents

SAMSUNG DISPLAY CO LTD

9 patents

PARK JAE-HWA

5 patents

PARK JAE HWA

3 patents

BAEK JONG-MIN

1 patent

TAE CHANG-IL

1 patent

SONG MIN-CHUL

1 patent

KANG PIL-KYU

1 patent

SON SEUNG-SUK

1 patent

Showing the top 50 of 62 patents by PatentIndex Score.