Inventor · disambiguated record
Hiromi Fujisawa
Also filed as: FUJISAWA HIROMI
6 granted patents·314 citations·filing 2003–2010
86Inventor score
Technology areasH10W
Files withKAIJO KK6
Top patents by PatentIndex Score
6 records- 0196US7262124B2Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatusKAIJO KK·Filed 2005·Granted Aug 28, 2007·118 cites·13 claims
- 0295US6933608B2Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatusKAIJO KK·Filed 2003·Granted Aug 23, 2005·144 cites·11 claims
- 0390US7815095B2Wire loop, semiconductor device having same and wire bonding methodKAIJO KK·Filed 2006·Granted Oct 19, 2010·35 cites·12 claims
- 0474US7748599B2Wire bonding method, wire bonding apparatus, and wire bonding control programKAIJO KK·Filed 2008·Granted Jul 6, 2010·8 cites·8 claims
- 0566US8016182B2Wire loop, semiconductor device having same and wire bonding methodKAIJO KK·Filed 2005·Granted Sep 13, 2011·8 cites·9 claims
- 0656US8042725B2Wire bonding method, wire bonding apparatus, and wire bonding control programKAIJO KK·Filed 2010·Granted Oct 25, 2011·1 cites·1 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →