Inventor · disambiguated record
Hiroyuki Hishinuma
Also filed as: HISHINUMA HIROYUKI
11 granted patents·154 citations·filing 1999–2006
91Inventor score
Top patents by PatentIndex Score
11 records- 0187US6653736B2Multilayer flexible wiring boardsSONY CHEMICALS CORP·Filed 2002·Granted Nov 25, 2003·36 cites·12 claims
- 0278US6524892B1Method of fabricating multilayer flexible wiring boardsSONY CHEMICALS CORP·Filed 2000·Granted Feb 25, 2003·21 cites·4 claims
- 0377US6294316B1Processes for manufacturing flexible printed wiring boardsSONY CHEMICALS CORP·Filed 2000·Granted Sep 25, 2001·22 cites·14 claims
- 0475US6643923B1Processes for manufacturing flexible wiring boardsSONY CHEMICALS CORP·Filed 1999·Granted Nov 11, 2003·30 cites·13 claims
- 0568US7109058B2Bumpless semiconductor deviceSONY CORP·Filed 2002·Granted Sep 19, 2006·13 cites·4 claims
- 0668US6930390B2Flexible printed wiring boardsSONY CHEMICALS CORP·Filed 2001·Granted Aug 16, 2005·13 cites·4 claims
- 0761US6848176B2Process for manufacturing flexible wiring boardsSONY CHEMICALS CORP·Filed 2003·Granted Feb 1, 2005·6 cites·13 claims
- 0859US7638876B2Bumpless semiconductor deviceSONY CHEM & INF DEVICE CORP·Filed 2006·Granted Dec 29, 2009·1 cites·1 claims
- 0956US6717064B1Substrate piece and flexible substrateSONY CHEMICALS CORP·Filed 2000·Granted Apr 6, 2004·6 cites·6 claims
- 1055US7053312B2Flexible wiring boardsSONY CHEMICALS CORP·Filed 2003·Granted May 30, 2006·4 cites·6 claims
- 1146US6812060B1Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boardsSONY CHEMICALS CORP·Filed 2000·Granted Nov 2, 2004·2 cites·14 claims
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