Inventor · disambiguated record
Ya Fang Chan
Also filed as: CHAN YA FANG
7 granted patents·1 pending application·5 citations·filing 2017–2024
73Inventor score
Files withADVANCED SEMICONDUCTOR ENG8
Top patents by PatentIndex Score
8 records- 0181US11037853B1Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 15, 2021·4 cites·20 claims
- 0272US2025029940A1Semiconductor device package and the method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 0365US12272687B2Semiconductor device package with conductive pillars and reinforcing and encapsulating layersADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Apr 8, 2025·0 cites·6 claims
- 0464US11056435B2Semiconductor package with chamfered padsADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 6, 2021·1 cites·25 claims
- 0561US12512337B2Method for manufacturing semiconductor package and apparatus for flattening workpieceADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 30, 2025·0 cites·19 claims
- 0659US12107056B2Semiconductor device package and the method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 1, 2024·0 cites·10 claims
- 0753US11521958B2Semiconductor device package with conductive pillars and reinforcing and encapsulating layersADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Dec 6, 2022·0 cites·6 claims
- 0852US11791227B2Electronic device packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 17, 2023·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →