Inventor · disambiguated record
Cheng-I Huang
Also filed as: HUANG CHENG · HUANG CHENG-I
37 granted patents·10 pending applications·195 citations·filing 2000–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD23TAIWAN SEMICONDUCTOR MFG8HEWLETT PACKARD DEVELOPMENT CO5FARADAY TECH CORP4TSAI YU-PIN2
Top patents by PatentIndex Score
47 records- 0192US8990762B2Semiconductor device design method, system and computer program productTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 24, 2015·19 cites·20 claims
- 0292US8813016B1Multiple via connections using connectivity ringsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 19, 2014·15 cites·20 claims
- 0391US8448120B2RC extraction for single patterning spacer techniqueHUANG CHENG-I·Filed 2011·Granted May 21, 2013·25 cites·18 claims
- 0490US9141752B2EDA tool and method for conflict detection during multi-patterning lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 22, 2015·11 cites·20 claims
- 0590US2025328718A1Integrated circuit, system for and method of forming an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0689US11228709B2Constructing images of users' faces by stitching non-overlapping imagesHEWLETT PACKARD DEVELOPMENT CO·Filed 2018·Granted Jan 18, 2022·7 cites·15 claims
- 0787US12417332B2Integrated circuit, system for and method of forming an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
- 0887US2025118674A1Standard-cell layout structure with horn power and smart metal cutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0985US8627243B1Methods for optimizing conductor patterns for ECP and CMP in semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 7, 2014·8 cites·20 claims
- 1084US9563731B2Cell boundaries for self aligned multiple patterning abutmentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 7, 2017·4 cites·19 claims
- 1184US9262558B2RC extraction for single patterning spacer techniqueTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 16, 2016·3 cites·20 claims
- 1283US8732641B1Pattern matching based parasitic extraction with pattern reuseTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 20, 2014·8 cites·17 claims
- 1383US2024395795A1Semiconductor device and layout thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1482US12073170B2Integrated circuit, system for and method of forming an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 1582US10854499B2Integrated circuit, system for and method of forming an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 1, 2020·2 cites·20 claims
- 1682US6895540B2Mux scan cell with delay circuit for reducing hold-time violationsFARADAY TECH CORP·Filed 2002·Granted May 17, 2005·27 cites·7 claims
- 1780US12159899B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 1880US10672708B2Standard-cell layout structure with horn power and smart metal cutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 2, 2020·2 cites·20 claims
- 1980US2025056847A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2079US12211793B2Standard-cell layout structure with horn power and smart metal cutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 2178US9659141B2EDA tool and method for conflict detection during multi-patterning lithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·2 cites·20 claims
- 2277US9213795B2Multiple via connections using connectivity ringsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 15, 2015·3 cites·20 claims
- 2377US8726212B1Streamlined parasitic modeling with common device profileTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 13, 2014·4 cites·20 claims
- 2474US8949758B1Hybrid design rule for double patterningTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·3 cites·20 claims
- 2574US7253662B2Method for forming an electric device comprising power switches around a logic circuit and related apparatusFARADAY TECH CORP·Filed 2005·Granted Aug 7, 2007·6 cites·16 claims
- 2673US11704465B2Integrated circuit, system for and method of forming an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 18, 2023·0 cites·20 claims
- 2771US12125839B2Semiconductor device and layout thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 22, 2024·0 cites·20 claims
- 2871US11437321B2Standard-cell layout structure with horn power and smart metal cutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 2969US11735625B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 22, 2023·0 cites·20 claims
- 3069US11727544B2Constructing images of users' faces by stitching non-overlapping imagesHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 3169US7165232B2I/O circuit placement method and semiconductor deviceFARADAY TECH CORP·Filed 2003·Granted Jan 16, 2007·15 cites·8 claims
- 3265US10128234B2Electromigration resistant semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·1 cites·20 claims
- 3362US10854593B2Semiconductor device and layout thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·0 cites·20 claims
- 3462US6978411B2Memory test system for peak power reductionFARADAY TECH CORP·Filed 2002·Granted Dec 20, 2005·14 cites·6 claims
- 3561US6872091B2Coaxial electrical connector with a switching functionDYNAHZ TECHNOLOGIES CORP·Filed 2003·Granted Mar 29, 2005·15 cites·4 claims
- 3660US10923426B2Standard-cell layout structure with horn power and smart metal cutTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 16, 2021·0 cites·20 claims
- 3759US8769451B2Semiconductor device design method, system and computer program productYUH PING-HUNG·Filed 2012·Granted Jul 1, 2014·1 cites·20 claims
- 3858US10163882B2Semiconductor device and layout thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 3952US9223922B2Semiconductor device design methodTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Dec 29, 2015·0 cites·20 claims
- 4049US11294286B2Pattern formation method using a photo mask for manufacturing a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·0 cites·20 claims
- 4143US2022129068A1Eye tracking for displaysHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 4242US2023176703A1Touch/pen sensors with pedot filmsHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
- 4341US2023266832A1Touch pen sensorHEWLETT PACKARD DEVELOPMENT CO·Filed 2020·Application pending·0 cites
- 4440US2013069242A1Arrangement of through-substrate vias for stress relief and improved densityYUH PING-YUNG·Filed 2011·Application pending·0 cites
- 4539US2008200037A1Method of thinning a waferTSAI YU-PIN·Filed 2007·Application pending·0 cites
- 4628US8728915B2Wafer laser-making method and die fabricated using the sameTSAI YU-PIN·Filed 2011·Granted May 20, 2014·0 cites·11 claims
- 4728US2002075058A1Apparatus for low-power, high performance, and cycle accurate test simulationFiled 2000·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →