Inventor · disambiguated record
Nobuyuki Hamakura
Also filed as: HAMAKURA NOBUYUKI
4 granted patents·1 pending application·6 citations·filing 2008–2012
62Inventor score
Technology areasB22F
Files withSEIKO EPSON CORP5
Top patents by PatentIndex Score
5 records- 0178US9249292B2Composition for injection molding, sintered compact, and method for producing sintered compactSEIKO EPSON CORP·Filed 2012·Granted Feb 2, 2016·3 cites·19 claims
- 0270US7993576B2Sintered body and method for producing the sameSEIKO EPSON CORP·Filed 2008·Granted Aug 9, 2011·3 cites·17 claims
- 0349US9309383B2Composition for injection molding, sintered compact, and method for producing sintered compactSEIKO EPSON CORP·Filed 2012·Granted Apr 12, 2016·0 cites·12 claims
- 0446US9045632B2Method for producing composition for injection molding comprising cryogenic grinding of resin components, and composition for injection moldingSEIKO EPSON CORP·Filed 2012·Granted Jun 2, 2015·0 cites·20 claims
- 0546US2008227906A1Composition for forming compact, degreased body, and sintered bodySEIKO EPSON CORP·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →