Inventor · disambiguated record
Daniela Florentina Bogorin
Also filed as: BOGORIN DANIELA F · BOGORIN DANIELA FLORENTINA
13 granted patents·1 pending application·37 citations·filing 2012–2022
88Inventor score
Top patents by PatentIndex Score
14 records- 0194US9771656B2Superhydrophobic films and methods for making superhydrophobic filmsAYTUG TOLGA·Filed 2012·Granted Sep 26, 2017·12 cites·31 claims
- 0291US12020115B2Trapped ion architecture in a dilution refrigerator for use with superconducting qubit systemsIBM·Filed 2020·Granted Jun 25, 2024·2 cites·15 claims
- 0391US11537929B2Superconducting interposer for the transmission of quantum information for quantum error correctionIBM·Filed 2021·Granted Dec 27, 2022·2 cites·12 claims
- 0488US11425841B2Using thermalizing material in an enclosure for cooling quantum computing devicesIBM·Filed 2019·Granted Aug 23, 2022·4 cites·20 claims
- 0588US10984335B2Superconducting interposer for the transmission of quantum information for quantum error correctionIBM·Filed 2019·Granted Apr 20, 2021·4 cites·20 claims
- 0685US11544613B2Controlling a quantum computing device based on predicted operation timeIBM·Filed 2019·Granted Jan 3, 2023·5 cites·23 claims
- 0785US11417822B2Frequency multiplexing for qubit readoutIBM·Filed 2019·Granted Aug 16, 2022·3 cites·16 claims
- 0884US11005574B2Superconducting interposer for optical transduction of quantum informationIBM·Filed 2019·Granted May 11, 2021·4 cites·25 claims
- 0977US11879789B2On-chip thermometer for superconducting quantum computing devicesIBM·Filed 2019·Granted Jan 23, 2024·1 cites·16 claims
- 1077US11875225B2Superconducting interposer for the transmission of quantum information for quantum error correctionIBM·Filed 2022·Granted Jan 16, 2024·0 cites·20 claims
- 1159US11889770B2Low loss conductive line using bridged conductorIBM·Filed 2020·Granted Jan 30, 2024·0 cites·25 claims
- 1256US11674854B2Mapping temperature distribution in superconducting devicesIBM·Filed 2019·Granted Jun 13, 2023·0 cites·25 claims
- 1353US12219737B2Cryogenic packaging for thermalization of low temperature devicesIBM·Filed 2019·Granted Feb 4, 2025·0 cites·16 claims
- 1445US2021068320A1Shielding for superconducting devicesIBM·Filed 2019·Application pending·0 cites
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