Inventor · disambiguated record
Mikio Komiyama
Also filed as: KOMIYAMA MIKIO
6 granted patents·403 citations·filing 1989–2007
88Inventor score
Top patents by PatentIndex Score
6 records- 0193US5118567AAdhesive tape and use thereofLINTEC CORP·Filed 1989·Granted Jun 2, 1992·100 cites·4 claims
- 0293US5110388AMethod of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tapeLINTEC CORP·Filed 1991·Granted May 5, 1992·150 cites·8 claims
- 0386US5356949AAdhesive composition comprising (meth)acrylate polymer and epoxy resinLINTEC CORP·Filed 1992·Granted Oct 18, 1994·75 cites·1 claims
- 0480US8587130B2Die-sorting sheet and method for transporting chips having adhesive layerHAMASAKI AKIE·Filed 2007·Granted Nov 19, 2013·18 cites·13 claims
- 0565US6139953AAdhesive tape, base material for adhesive tape and their manufacturing methodsLINTEC CORP·Filed 1997·Granted Oct 31, 2000·34 cites·27 claims
- 0659US5691038ACover tape and coating applicatorLINTEC CORP·Filed 1994·Granted Nov 25, 1997·26 cites·22 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →