Inventor · disambiguated record
Taylor Gaines
Also filed as: GAINES TAYLOR · GAINES TAYLOR W · GAINES TAYLOR WILLIAM
11 granted patents·11 pending applications·6 citations·filing 2016–2021
81Inventor score
Top patents by PatentIndex Score
22 records- 0192US11370887B2Aliphatic polysulfones with improved mechanical integrityUNIV FLORIDA·Filed 2021·Granted Jun 28, 2022·2 cites·12 claims
- 0285US9724686B2Sulfonated polyethyleneUNIV FLORIDA·Filed 2016·Granted Aug 8, 2017·2 cites·11 claims
- 0374US11001673B2Aliphatic polysulfones with improved mechanical integrityUNIV FLORIDA·Filed 2019·Granted May 11, 2021·0 cites·12 claims
- 0470US11842944B2IC assemblies including die perimeter frames suitable for containing thermal interface materialsINTEL CORP·Filed 2019·Granted Dec 12, 2023·2 cites·22 claims
- 0561US2021375719A1Stacked die architectures with improved thermal managementINTEL CORP·Filed 2021·Application pending·0 cites
- 0658US10894864B2Aliphatic polysulfones with improved mechanical integrityUNIV FLORIDA·Filed 2017·Granted Jan 19, 2021·0 cites·20 claims
- 0754US11935861B2Underfill flow management in electronic assembliesINTEL CORP·Filed 2020·Granted Mar 19, 2024·0 cites·16 claims
- 0853US11676876B2Semiconductor die package with warpage management and process for forming suchINTEL CORP·Filed 2019·Granted Jun 13, 2023·0 cites·26 claims
- 0950US2021269572A1Improving the mechanical integrity of polysulfonic acidsUNIV FLORIDA·Filed 2019·Application pending·0 cites
- 1049US11881440B2Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bondsINTEL CORP·Filed 2020·Granted Jan 23, 2024·0 cites·18 claims
- 1148US11710672B2Microelectronic package with underfilled sealantINTEL CORP·Filed 2019·Granted Jul 25, 2023·0 cites·20 claims
- 1246US11935799B2Integrated circuit package lids with polymer featuresINTEL CORP·Filed 2019·Granted Mar 19, 2024·0 cites·18 claims
- 1346US11710677B2Ultraviolet (UV)-curable sealant in a microelectronic packageINTEL CORP·Filed 2019·Granted Jul 25, 2023·0 cites·19 claims
- 1446US2018342463A1Conductive adhesive layer for semiconductor devices and packagesINTEL CORP·Filed 2018·Application pending·0 cites
- 1546US2019214328A1Stacked die architectures with improved thermal managementEID FERAS·Filed 2018·Application pending·0 cites
- 1643US2018190593A1Conductive adhesive layer for semiconductor devices and packagesINTEL CORP·Filed 2016·Application pending·0 cites
- 1741US2020388576A1Layer for etched identification marks on a packageINTEL CORP·Filed 2019·Application pending·0 cites
- 1841US2019202136A1Component coupling via plurality of adhesive elementsINTEL CORP·Filed 2017·Application pending·0 cites
- 1936US2019206753A1Bicontinuous porous ceramic composite for semiconductor package applicationsINTEL CORP·Filed 2017·Application pending·0 cites
- 2036US2020006169A1Micro-electronic package with barrier structureINTEL CORP·Filed 2018·Application pending·0 cites
- 2136US2020005983A1Magnetic encapsulant for package magnetic inductorsINTEL CORP·Filed 2018·Application pending·0 cites
- 2232US2018235075A1Shielding for semiconductor optoelectronic devices and packagesINTEL CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →