Inventor · disambiguated record
Eiji Mochizuki
Also filed as: MOCHIZUKI EIJI
50 granted patents·6 pending applications·555 citations·filing 2000–2025
98Inventor score
Files withFUJI ELECTRIC CO LTD22FUJI ELEC DEVICE TECH CO LTD8RICOH KK8FUJI ELECTRIC SYSTEMS CO LTD2WISCONSIN ALUMNI RES FOUND2
Top patents by PatentIndex Score
56 records- 0197US6657765B2Optical deflecting unit, optical scanning unit, image forming apparatus, and method of producing optical unitRICOH KK·Filed 2002·Granted Dec 2, 2003·113 cites·24 claims
- 0295USD587662SSemiconductor deviceFUJI ELEC DEVICE TECH CO LTD·Filed 2008·Granted Mar 3, 2009·83 cites·1 claims
- 0394US7068296B2Optical scanning device for reducing a dot position displacement at a joint of scanning linesRICOH KK·Filed 2002·Granted Jun 27, 2006·80 cites·12 claims
- 0491US9504154B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Nov 22, 2016·12 cites·8 claims
- 0588US6995461B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2002·Granted Feb 7, 2006·52 cites·16 claims
- 0686USD674760SSemiconductor deviceFUJI ELECTRIC CO LTD·Filed 2011·Granted Jan 22, 2013·39 cites·1 claims
- 0785US6485126B1Ink jet head and method of producing the sameRICOH KK·Filed 2000·Granted Nov 26, 2002·27 cites·25 claims
- 0884US7705443B2Semiconductor device with lead frame including conductor plates arranged three-dimensionallyFUJI ELEC DEVICE TECH CO LTD·Filed 2007·Granted Apr 27, 2010·14 cites·19 claims
- 0984US7031040B2Optical scanning apparatus, optical writing apparatus, image forming apparatus, and method of driving vibration mirrorRICOH KK·Filed 2004·Granted Apr 18, 2006·21 cites·23 claims
- 1081US7593029B2Optical scanning device and image forming apparatus using the sameRICOH KK·Filed 2002·Granted Sep 22, 2009·17 cites·9 claims
- 1180US7551339B2Optical scanning apparatus, optical writing apparatus, image forming apparatus, and method of driving vibration mirrorRICOH KK·Filed 2007·Granted Jun 23, 2009·7 cites·4 claims
- 1279US7944042B2Semiconductor device and method of manufacturing sameFUJI ELEC DEVICE TECH CO LTD·Filed 2008·Granted May 17, 2011·12 cites·10 claims
- 1378US10128166B2Power semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2016·Granted Nov 13, 2018·3 cites·15 claims
- 1477US7723846B2Power semiconductor module and method of manufacturing the sameFUJI ELEC DEVICE TECH CO LTD·Filed 2005·Granted May 25, 2010·9 cites·12 claims
- 1577US7403317B2Optical scanning device and method of manufacturing the sameRICOH KK·Filed 2005·Granted Jul 22, 2008·8 cites·23 claims
- 1677US7038313B2Semiconductor device and method of manufacturing the sameFUJI ELEC DEVICE TECH CO LTD·Filed 2004·Granted May 2, 2006·20 cites·10 claims
- 1774US8944310B2Method of manufacturing a semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Feb 3, 2015·3 cites·8 claims
- 1873US10297527B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted May 21, 2019·2 cites·9 claims
- 1972US9786587B2Semiconductor device and method for manufacturing the semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2016·Granted Oct 10, 2017·2 cites·20 claims
- 2071US12451454B2Manufacturing method of packaging structure for bipolar transistor with constricted bumpsFUJI ELECTRIC CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·6 claims
- 2168US9269644B2Method for producing semiconductor deviceNISHIMURA YOSHITAKA·Filed 2013·Granted Feb 23, 2016·2 cites·16 claims
- 2266US10355089B2Semiconductor device and semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2015·Granted Jul 16, 2019·1 cites·12 claims
- 2365US8796798B2Imaging module, fabricating method therefor, and imaging deviceMINEGISHI DAIKI·Filed 2011·Granted Aug 5, 2014·1 cites·11 claims
- 2464US11705419B2Packaging structure for bipolar transistor with constricted bumpsFUJI ELECTRIC CO LTD·Filed 2020·Granted Jul 18, 2023·0 cites·13 claims
- 2564US7312912B2Optical scanning apparatus, optical writing apparatus, image forming apparatus, and method of driving vibration mirrorRICOH KK·Filed 2006·Granted Dec 25, 2007·2 cites·8 claims
- 2664US2025112143A1Semiconductor device, semiconductor module and manufacturing methodFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 2763US10090223B2Semiconductor device and method of manufacturing sameFUJI ELECTRIC CO LTD·Filed 2017·Granted Oct 2, 2018·1 cites·8 claims
- 2863US7902653B2Semiconductor moduleFUJI ELECTRIC SYSTEMS CO LTD·Filed 2008·Granted Mar 8, 2011·2 cites·7 claims
- 2962US2025218887A1Semiconductor device and manufacturing method of semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 3061US8598688B2Semiconductor deviceFUKUDA KYOHEI·Filed 2011·Granted Dec 3, 2013·2 cites·9 claims
- 3160US9406603B2Semiconductor device and method for manufacturing the semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2014·Granted Aug 2, 2016·1 cites·11 claims
- 3259US11531075B2Method and apparatus for integrating current sensors in a power semiconductor moduleWISCONSIN ALUMNI RES FOUND·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 3358US9431326B2Semiconductor device and manufacturing method thereofDENTA TOSHIO·Filed 2012·Granted Aug 30, 2016·2 cites·7 claims
- 3458US8158458B2Power semiconductor module and method of manufacturing the sameIKAWA OSAMU·Filed 2009·Granted Apr 17, 2012·3 cites·19 claims
- 3557US8553306B2Optical deflector and optical deviceSAITOH TETSUROU·Filed 2008·Granted Oct 8, 2013·3 cites·21 claims
- 3657US6905063B2Method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2003·Granted Jun 14, 2005·7 cites·26 claims
- 3756US2006157862A1Semiconductor device and method for producing the sameFUJI ELEC DEVICE TECH CO LTD·Filed 2006·Application pending·0 cites
- 3854US2025372558A1Semiconductor module and manufacturing methodFUJI ELECTRIC CO LTD·Filed 2025·Application pending·0 cites
- 3951US11545409B2Semiconductor module having block electrode bonded to collector electrode and manufacturing method thereofFUJI ELECTRIC CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·17 claims
- 4050US9579746B2Thermocompression bonding structure and thermocompression bonding methodFUJI ELECTRIC CO LTD·Filed 2014·Granted Feb 28, 2017·0 cites·4 claims
- 4149US8748225B2Semiconductor device manufacturing methodFUJI ELECTRIC CO LTD·Filed 2013·Granted Jun 10, 2014·0 cites·11 claims
- 4248US8026566B2Semiconductor device and method for manufacturing semiconductor deviceFUJI ELECTRIC SYSTEMS CO LTD·Filed 2008·Granted Sep 27, 2011·0 cites·4 claims
- 4346US7985630B2Method for manufacturing semiconductor moduleFUJI ELEC DEVICE TECH CO LTD·Filed 2010·Granted Jul 26, 2011·0 cites·6 claims
- 4445US11085977B2Method and apparatus for integrating current sensors in a power semiconductor moduleWISCONSIN ALUMNI RES FOUND·Filed 2017·Granted Aug 10, 2021·0 cites·19 claims
- 4545US8462417B2Light adjusting apparatus for positioning an incident light adjusting unitIDE TAKAYUKI·Filed 2010·Granted Jun 11, 2013·0 cites·17 claims
- 4644US7368380B2Method of manufacturing semiconductor deviceFUJI ELEC DEVICE TECH CO LTD·Filed 2004·Granted May 6, 2008·2 cites·5 claims
- 4743US9999146B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2016·Granted Jun 12, 2018·0 cites·13 claims
- 4842US10090222B2Semiconductor device with heat dissipation and method of making sameFUJI ELECTRIC CO LTD·Filed 2018·Granted Oct 2, 2018·0 cites·8 claims
- 4942US2007154336A1Fluid transportation deviceMISUZU IND CORP·Filed 2006·Application pending·0 cites
- 5041US2009121442A1Method of manufacturing ring-shaped member, backup ring and seal structure for fuel injection valveUOZUMI YASUFUMI·Filed 2006·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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