Inventor · disambiguated record
Da Hee Kim
Also filed as: KIM DA HEE
11 granted patents·12 pending applications·16 citations·filing 2012–2022
84Inventor score
Top patents by PatentIndex Score
23 records- 0187US10573613B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 25, 2020·5 cites·21 claims
- 0280US10522451B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·2 cites·20 claims
- 0379US9706668B2Printed circuit board, electronic module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 11, 2017·4 cites·22 claims
- 0474US10692805B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 23, 2020·2 cites·19 claims
- 0571US10211136B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 19, 2019·1 cites·18 claims
- 0670US10770418B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 8, 2020·1 cites·18 claims
- 0768US10622273B2Semiconductor package with improved flatness of an insulating layer formed on patternsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·1 cites·11 claims
- 0862US11121066B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·11 claims
- 0955US2023330005A1Self-assembled complex containing calcium ionUNIV KOREA RES & BUS FOUND·Filed 2022·Application pending·0 cites
- 1049US2015061093A1Interposer and semiconductor package using the same, and method of manufacturing interposerSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1149US2015101857A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1249US2015129291A1Printed circuit board and method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1346US2014102766A1Multi-layer type coreless substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1446US2014014398A1Coreless subtrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1544US10402620B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·21 claims
- 1643US2014102767A1Multi-layer type printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1742US10872863B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 22, 2020·0 cites·20 claims
- 1842US2014027156A1Multilayer type coreless substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1941US2019206756A1Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 2039US2019139920A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 2138US10403583B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·19 claims
- 2234US2016021736A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2334US2016081195A1Detach core substrate and method for manufacturing thereofSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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