Inventor · disambiguated record
Arvind S. Salian
Also filed as: SALIAN ARVIND · SALIAN ARVIND S
7 granted patents·3 pending applications·438 citations·filing 2001–2017
87Inventor score
Top patents by PatentIndex Score
10 records- 0196US7109055B2Methods and apparatus having wafer level chip scale package for sensing elementsFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Sep 19, 2006·60 cites·20 claims
- 0295US7030469B2Method of forming a semiconductor package and structure thereofFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Apr 18, 2006·332 cites·11 claims
- 0392US9790089B2MEMS sensor with side port and method of fabricating sameNXP USA INC·Filed 2017·Granted Oct 17, 2017·9 cites·20 claims
- 0483US7316965B2Substrate contact for a capped MEMS and method of making the substrate contact at the wafer levelFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jan 8, 2008·13 cites·18 claims
- 0579US10393618B2Controlled pulse generation methods and apparatuses for evaluating stiction in microelectromechanical systems devicesFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Aug 27, 2019·3 cites·18 claims
- 0678US6718605B2Single-side microelectromechanical capacitive accelerometer and method of making sameUNIV MICHIGAN·Filed 2001·Granted Apr 13, 2004·20 cites·9 claims
- 0771US9988260B2Rough MEMS surfaceFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Jun 5, 2018·1 cites·22 claims
- 0845US2017081179A1Mems sensor with side port and method of fabricating sameFREESCALE SEMICONDUCTOR INC·Filed 2015·Application pending·0 cites
- 0938US2006286706A1Method of making a substrate contact for a capped MEMS at the package levelSALIAN ARVIND S·Filed 2005·Application pending·0 cites
- 1036US2017115322A1Mems sensor device having integrated multiple stimulus sensingFREESCALE SEMICONDUCTOR INC·Filed 2015·Application pending·0 cites
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