Inventor · disambiguated record
Kunihiko Nishi
Also filed as: NISHI KUNIHIKO
104 granted patents·6 pending applications·4,041 citations·filing 1979–2021
99Inventor score
Files withHITACHI LTD74RENESAS TECH CORP12ELPIDA MEMORY INC5HITACHI ULSI SYS CO LTD3NAKAMURA ATSUSHI3
Top patents by PatentIndex Score
110 records- 0198USRE42972ESemiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereofNAKAMURA ATSUSHI·Filed 2005·Granted Nov 29, 2011·59 cites·46 claims
- 0298USRE41478ESemiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereofRENESAS ELECTRONICS CORP·Filed 2005·Granted Aug 10, 2010·62 cites·44 claims
- 0398US5777391ASemiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereofHITACHI LTD·Filed 1995·Granted Jul 7, 1998·256 cites·25 claims
- 0498US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0597US5198888ASemiconductor stacked deviceHITACHI LTD·Filed 1990·Granted Mar 30, 1993·353 cites·11 claims
- 0696US6291273B1Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 1996·Granted Sep 18, 2001·208 cites·18 claims
- 0795US7420284B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·39 cites·9 claims
- 0895US5095626AMethod of producing semiconductor memory packagesHITACHI LTD·Filed 1989·Granted Mar 17, 1992·84 cites·35 claims
- 0994USRE41721ESemiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodesRENESAS ELECTRONICS CORP·Filed 2000·Granted Sep 21, 2010·59 cites·60 claims
- 1094USRE41722ESemiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereofRENESAS ELECTRONICS CORP·Filed 2002·Granted Sep 21, 2010·60 cites·30 claims
- 1194US6521981B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Feb 18, 2003·37 cites·18 claims
- 1294US6342728B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Jan 29, 2002·38 cites·12 claims
- 1394US5028986ASemiconductor device and semiconductor module with a plurality of stacked semiconductor devicesHITACHI LTD·Filed 1988·Granted Jul 2, 1991·115 cites·34 claims
- 1493US5266834ASemiconductor device and an electronic device with the semiconductor devices mounted thereonHITACHI LTD·Filed 1992·Granted Nov 30, 1993·262 cites·31 claims
- 1592US6670215B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Dec 30, 2003·28 cites·4 claims
- 1692US6472727B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Oct 29, 2002·31 cites·20 claims
- 1792US5334875AStacked semiconductor memory device and semiconductor memory module containing the sameHITACHI LTD·Filed 1993·Granted Aug 2, 1994·128 cites·56 claims
- 1892US4971196ASurface package type semiconductor packageHITACHI LTD·Filed 1989·Granted Nov 20, 1990·66 cites·19 claims
- 1991US7091620B2Semiconductor device and manufacturing method thereofAKITA ELECTRONICS SYSTEMS CO L·Filed 2005·Granted Aug 15, 2006·21 cites·20 claims
- 2091US6867123B2Semiconductor integrated circuit device and its manufacturing methodRENESAS TECH CORP·Filed 2001·Granted Mar 15, 2005·76 cites·21 claims
- 2191US6342726B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 1999·Granted Jan 29, 2002·42 cites·9 claims
- 2290US5714405ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Feb 3, 1998·98 cites·40 claims
- 2389US5184208ASemiconductor deviceHITACHI LTD·Filed 1991·Granted Feb 2, 1993·115 cites·34 claims
- 2488US8704352B2Semiconductor device having a liquid cooling moduleHISANO NAE·Filed 2010·Granted Apr 22, 2014·11 cites·18 claims
- 2586US6642083B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Nov 4, 2003·17 cites·10 claims
- 2686US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 2786US5295297AMethod of producing semiconductor memoryHITACHI LTD·Filed 1992·Granted Mar 22, 1994·75 cites·27 claims
- 2886US4933744AResin encapsulated electronic devicesHITACHI LTD·Filed 1988·Granted Jun 12, 1990·72 cites·30 claims
- 2985US6365439B2Method of manufacturing a ball grid array type semiconductor packageHITACHI LTD·Filed 2001·Granted Apr 2, 2002·17 cites·19 claims
- 3085US5914531ASemiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1997·Granted Jun 22, 1999·68 cites·21 claims
- 3185US5583375ASemiconductor device with lead structure within the planar area of the deviceHITACHI LTD·Filed 1992·Granted Dec 10, 1996·73 cites·39 claims
- 3285US5150193AResin-encapsulated semiconductor device having a particular mounting structureHITACHI LTD·Filed 1991·Granted Sep 22, 1992·107 cites·28 claims
- 3384US6169325B1Semiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 2, 2001·82 cites·12 claims
- 3484US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 3583US6355500B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·14 cites·15 claims
- 3680US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 3780US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 3880US4989166AMethod for synthesizing analysis model and flow analysis systemHITACHI LTD·Filed 1989·Granted Jan 29, 1991·66 cites·12 claims
- 3979US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 4078US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 4178US5371044AMethod of uniformly encapsulating a semiconductor device in resinHITACHI LTD·Filed 1992·Granted Dec 6, 1994·60 cites·20 claims
- 4277US7541667B2Semiconductor device and method of manufacturing the sameHITACHI LTD·Filed 2005·Granted Jun 2, 2009·6 cites·7 claims
- 4376US6960823B2Semiconductor device and method of manufacturing the sameHITACHI ULSI SYS CO LTD·Filed 2002·Granted Nov 1, 2005·18 cites·3 claims
- 4475US6114192AMethod of manufacturing a semiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1998·Granted Sep 5, 2000·39 cites·38 claims
- 4575US5200366ASemiconductor device, its fabrication method and molding apparatus used thereforHITACHI LTD·Filed 1991·Granted Apr 6, 1993·60 cites·16 claims
- 4674US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 4773USRE43444ESemiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodesNAKAMURA ATSUSHI·Filed 2005·Granted Jun 5, 2012·3 cites·36 claims
- 4873US7754581B2Method for manufacturing a three-dimensional semiconductor device and a wafer used thereinELPIDA MEMORY INC·Filed 2007·Granted Jul 13, 2010·5 cites·6 claims
- 4973US5572430AMethod and apparatus for cooperated designHITACHI LTD·Filed 1992·Granted Nov 5, 1996·75 cites·9 claims
- 5071US6664135B2Method of manufacturing a ball grid array type semiconductor packageRENESAS TECH CORP·Filed 2002·Granted Dec 16, 2003·7 cites·16 claims
Showing the top 50 of 110 patent records by PatentIndex Score.
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