Inventor · disambiguated record
Toshimi Kohmura
Also filed as: KOHMURA TOSHIMI
8 granted patents·1 pending application·371 citations·filing 1990–2009
89Inventor score
Top patents by PatentIndex Score
9 records- 0196US6407929B1Electronic package having embedded capacitors and method of fabrication thereforINTEL CORP·Filed 2000·Granted Jun 18, 2002·220 cites·29 claims
- 0289US8115307B2Embedding device in substrate cavityTOYAMA MUNEHIRO·Filed 2009·Granted Feb 14, 2012·18 cites·14 claims
- 0386US7592202B2Embedding device in substrate cavityINTEL CORP·Filed 2006·Granted Sep 22, 2009·12 cites·7 claims
- 0479US7394159B2Delamination reduction between vias and conductive padsINTEL CORP·Filed 2005·Granted Jul 1, 2008·10 cites·10 claims
- 0578US5822194AElectronic part mounting deviceIBIDEN CO LTD·Filed 1995·Granted Oct 13, 1998·61 cites·7 claims
- 0662US5160783AEpoxy resin-impregnated glass cloth sheet having adhesive layerMITSUBISHI PETROCHEMICAL CO·Filed 1990·Granted Nov 3, 1992·29 cites·12 claims
- 0748US6303873B1Electronic part module and process for manufacturing the sameIBIDEN CO LTD·Filed 1996·Granted Oct 16, 2001·14 cites·4 claims
- 0836US2006172061A1Method and apparatus for substrate fabricationKOHMURA TOSHIMI·Filed 2003·Application pending·0 cites
- 0935US5956237APrimary printed wiring boardIBIDEN CO LTD·Filed 1994·Granted Sep 21, 1999·7 cites·9 claims
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