Inventor · disambiguated record
Kong Weng Lee
Also filed as: LEE KONG WENG
8 granted patents·2 pending applications·32 citations·filing 2003–2019
82Inventor score
Files withLUMENTUM OPERATIONS LLC4AVAGO TECH ECBU IP SG PTE LTD2LEE KONG WENG2AVAGO TECHNOLOGIES ECBUIP SING1JDS UNIPHASE CORP1
Top patents by PatentIndex Score
10 records- 0185US7919787B2Semiconductor device with a light emitting semiconductor dieAVAGO TECH ECBU IP SG PTE LTD·Filed 2007·Granted Apr 5, 2011·13 cites·14 claims
- 0265US9300112B2Packaged laser diode and method of packaging a laser diodeJDS UNIPHASE CORP·Filed 2013·Granted Mar 29, 2016·2 cites·20 claims
- 0357US9123869B2Semiconductor device with a light emitting semiconductor dieLEE KONG WENG·Filed 2011·Granted Sep 1, 2015·1 cites·13 claims
- 0457US8537873B2High power surface mount technology package for side emitting laser diodeLEE KONG WENG·Filed 2012·Granted Sep 17, 2013·1 cites·11 claims
- 0557US7256486B2Packaging device for semiconductor die, semiconductor device incorporating same and method of making sameAVAGO TECH ECBU IP SG PTE LTD·Filed 2003·Granted Aug 14, 2007·8 cites·6 claims
- 0656US2018145480A1Reflector and a laser diode assembly using sameLUMENTUM OPERATIONS LLC·Filed 2018·Application pending·0 cites
- 0755US7279355B2Method for fabricating a packaging device for semiconductor die and semiconductor device incorporating sameAVAGO TECHNOLOGIES ECBUIP SING·Filed 2003·Granted Oct 9, 2007·7 cites·12 claims
- 0851US2016359296A1Reflector and a laser diode assembly using sameLUMENTUM OPERATIONS LLC·Filed 2015·Application pending·0 cites
- 0950US10763639B2Emitter-on-sub-mount deviceLUMENTUM OPERATIONS LLC·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 1040US9728935B2Chip-scale package and semiconductor device assemblyLUMENTUM OPERATIONS LLC·Filed 2015·Granted Aug 8, 2017·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →