Inventor · disambiguated record
Do Hyun Na
Also filed as: NA DO HYUN
15 granted patents·4 pending applications·182 citations·filing 2005–2024
91Inventor score
Files withAMKOR TECHNOLOGY INC8AMKOR TECH SINGAPORE HOLDING PTE LTD4LEE CHOON HEUNG2MEDICARE PHARMACEUTICALS INC2HWANG CHAN HA1
Top patents by PatentIndex Score
19 records- 0196US7227236B1Image sensor package and its manufacturing methodAMKOR TECHNOLOGY INC·Filed 2005·Granted Jun 5, 2007·77 cites·20 claims
- 0295US8802494B2Method of fabricating a semiconductor device having an interposerLEE CHOON HEUNG·Filed 2012·Granted Aug 12, 2014·47 cites·3 claims
- 0393US7808084B1Semiconductor package with half-etched locking featuresAMKOR TECHNOLOGY INC·Filed 2008·Granted Oct 5, 2010·33 cites·21 claims
- 0482US2025022784A1Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0578US8125064B1Increased I/O semiconductor package and method of making sameLEE CHANG DEOK·Filed 2008·Granted Feb 28, 2012·10 cites·20 claims
- 0676US12107035B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 0776US8183678B2Semiconductor device having an interposerLEE CHOON HEUNG·Filed 2009·Granted May 22, 2012·7 cites·13 claims
- 0873US10090230B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2014·Granted Oct 2, 2018·2 cites·21 claims
- 0968US9418942B2Semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2014·Granted Aug 16, 2016·2 cites·20 claims
- 1065US8198738B1Structure of bond pad for semiconductor die and method thereforHWANG CHAN HA·Filed 2007·Granted Jun 12, 2012·4 cites·23 claims
- 1165US2022320010A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 1259US11430723B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 30, 2022·0 cites·21 claims
- 1350US11285188B2Composition for preventing or treating metabolic diseases containing artemisiae capillaris herba and citrus unshiu peel complex extracts as active ingredientsMEDICARE PHARMACEUTICALS INC·Filed 2019·Granted Mar 29, 2022·0 cites·4 claims
- 1446US11292789B1Composition for inhibiting growth of SARS-CoV-2 and method of preparing the sameMEDICARE PHARMACEUTICALS INC·Filed 2020·Granted Apr 5, 2022·0 cites·10 claims
- 1546US2016211221A1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 1644US9513254B2Microfluidic sensor package structure and methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Dec 6, 2016·0 cites·12 claims
- 1740US11328969B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2017·Granted May 10, 2022·0 cites·12 claims
- 1836US2018134546A1Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 1931US11485501B2Drone, parachute kit for drones, and method of controlling dronesNA DO HYUN·Filed 2019·Granted Nov 1, 2022·0 cites·9 claims
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