Inventor · disambiguated record
Dae Byung Kang
Also filed as: KANG DAE · KANG DAE B · KANG DAE-BYUNG
5 granted patents·1 pending application·124 citations·filing 1994–2023
79Inventor score
Top patents by PatentIndex Score
6 records- 0178US6479887B1Circuit pattern tape for wafer-scale production of chip size semiconductor packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Nov 12, 2002·59 cites·28 claims
- 0277US6589801B1Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniquesAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 8, 2003·55 cites·37 claims
- 0348US2023315776A1System and method for detecting and delivering key moments during live eventsBUZZER TECH INC·Filed 2023·Application pending·0 cites
- 0440US6252213B1Method and apparatus for compensating cooking time of microwave ovenLG ELECTRONICS INC·Filed 2000·Granted Jun 26, 2001·1 cites·13 claims
- 0540US5558799AApparatus and method for controlling turntable of microwave ovenGOLD STAR CO·Filed 1994·Granted Sep 24, 1996·9 cites·13 claims
- 0635US6677558B2Key input apparatus in electronic oven and control method thereofLG ELECTRONICS INC·Filed 2001·Granted Jan 13, 2004·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →