Inventor · disambiguated record
Kunihiro Tsubosaki
Also filed as: TSUBOSAKI KUNIHIRO
85 granted patents·8 pending applications·2,442 citations·filing 1981–2007
99Inventor score
Files withHITACHI LTD64RENESAS TECH CORP10DAINIPPON PRINTING CO LTD4HITACHI ULSI SYS CO LTD2AKITA ELECTRONICS SYSTEMS CO L1
Top patents by PatentIndex Score
93 records- 0198US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0296US6291273B1Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 1996·Granted Sep 18, 2001·208 cites·18 claims
- 0396US5637913ALeadframe semiconductor integrated circuit device using the same and method of and process for fabricating the twoHITACHI LTD·Filed 1994·Granted Jun 10, 1997·96 cites·14 claims
- 0496US5378656ALeadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the sameHITACHI LTD·Filed 1993·Granted Jan 3, 1995·103 cites·23 claims
- 0595US7420284B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2006·Granted Sep 2, 2008·39 cites·9 claims
- 0694US6521981B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Feb 18, 2003·37 cites·18 claims
- 0794US6342728B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Jan 29, 2002·38 cites·12 claims
- 0893US6342434B1Methods of processing semiconductor wafer, and producing IC card, and carrierHITACHI LTD·Filed 1996·Granted Jan 29, 2002·136 cites·4 claims
- 0992US6670215B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2002·Granted Dec 30, 2003·28 cites·4 claims
- 1092US6472727B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Oct 29, 2002·31 cites·20 claims
- 1191US7091620B2Semiconductor device and manufacturing method thereofAKITA ELECTRONICS SYSTEMS CO L·Filed 2005·Granted Aug 15, 2006·21 cites·20 claims
- 1291US6589855B2Methods of processing semiconductor wafer and producing IC card, and carrierHITACHI LTD·Filed 2001·Granted Jul 8, 2003·57 cites·19 claims
- 1391US6342726B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 1999·Granted Jan 29, 2002·42 cites·9 claims
- 1490US5714405ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Feb 3, 1998·98 cites·40 claims
- 1588US6114753ACircuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 1997·Granted Sep 5, 2000·50 cites·23 claims
- 1686US6642083B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Nov 4, 2003·17 cites·10 claims
- 1786US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 1885US6365439B2Method of manufacturing a ball grid array type semiconductor packageHITACHI LTD·Filed 2001·Granted Apr 2, 2002·17 cites·19 claims
- 1985US5583375ASemiconductor device with lead structure within the planar area of the deviceHITACHI LTD·Filed 1992·Granted Dec 10, 1996·73 cites·39 claims
- 2084US6573158B2Methods of processing semiconductor wafer and producing IC card, and carrierHITACHI LTD·Filed 2001·Granted Jun 3, 2003·29 cites·18 claims
- 2184US5874773ALead frame having a supporting pad with a plurality of slits arranged to permit the flow of resin so as to prevent the occurrence of voidsHITACHI LTD·Filed 1997·Granted Feb 23, 1999·78 cites·12 claims
- 2284US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 2383US6355500B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 12, 2002·14 cites·15 claims
- 2483US5466888APackaged semiconductor device having stress absorbing filmHITACHI LTD·Filed 1995·Granted Nov 14, 1995·72 cites·6 claims
- 2582US6759272B2Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2003·Granted Jul 6, 2004·28 cites·8 claims
- 2682US4803543ASemiconductor device and process for producing the sameHITACHI LTD·Filed 1981·Granted Feb 7, 1989·54 cites·22 claims
- 2781US4951122AResin-encapsulated semiconductor deviceHITACHI LTD·Filed 1988·Granted Aug 21, 1990·54 cites·35 claims
- 2880US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 2980US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 3079US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 3178US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 3278US5431324AUltrasonic bonding apparatus and quality monitoring methodHITACHI LTD·Filed 1993·Granted Jul 11, 1995·69 cites·12 claims
- 3375US6140697ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 31, 2000·35 cites·21 claims
- 3474US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 3572US5986341ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Nov 16, 1999·31 cites·55 claims
- 3671US6791194B1Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 14, 2004·18 cites·18 claims
- 3771US6664616B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 1996·Granted Dec 16, 2003·36 cites·15 claims
- 3871US6664135B2Method of manufacturing a ball grid array type semiconductor packageRENESAS TECH CORP·Filed 2002·Granted Dec 16, 2003·7 cites·16 claims
- 3969US6441502B2Member for mounting of semiconductorDAINIPPON PRINTING CO LTD·Filed 2000·Granted Aug 27, 2002·12 cites·10 claims
- 4069US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 4169US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 4268US6589818B2Method for mounting a thin semiconductor deviceHITACHI LTD·Filed 2002·Granted Jul 8, 2003·10 cites·4 claims
- 4368US6353255B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2001·Granted Mar 5, 2002·6 cites·7 claims
- 4468US6307269B1Semiconductor device with chip size packageHITACHI LTD·Filed 1998·Granted Oct 23, 2001·32 cites·23 claims
- 4567US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 4667US6515371B2Semiconductor device with elastic structure and wiringHITACHI LTD·Filed 2001·Granted Feb 4, 2003·13 cites·8 claims
- 4767US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 4866US6906429B2Semiconductor device and method of fabricating the sameDAINIPPON PRINTING CO LTD·Filed 2003·Granted Jun 14, 2005·9 cites·11 claims
- 4965US7247576B2Method of manufacturing a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jul 24, 2007·2 cites·4 claims
- 5065US6558980B2Plastic molded type semiconductor device and fabrication process thereofFiled 2001·Granted May 6, 2003·11 cites·8 claims
Showing the top 50 of 93 patent records by PatentIndex Score.
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