Inventor · disambiguated record
Hisashi Kaneko
Also filed as: KANEKO HISASHI
85 granted patents·22 pending applications·2,797 citations·filing 1990–2010
99Inventor score
Top patents by PatentIndex Score
107 records- 0197US6632335B2Plating apparatusEBARA CORP·Filed 2000·Granted Oct 14, 2003·114 cites·77 claims
- 0297US6563308B2Eddy current loss measuring sensor, thickness measuring system, thickness measuring method, and recorded mediumTOSHIBA KK·Filed 2001·Granted May 13, 2003·144 cites·47 claims
- 0397US5770095APolishing agent and polishing method using the sameTOSHIBA KK·Filed 1995·Granted Jun 23, 1998·413 cites·15 claims
- 0496US6375823B1Plating method and plating apparatusTOSHIBA KK·Filed 2000·Granted Apr 23, 2002·96 cites·12 claims
- 0595US6638411B1Method and apparatus for plating substrate with copperEBARA CORP·Filed 2000·Granted Oct 28, 2003·46 cites·13 claims
- 0693US7921401B2Stress analysis method, wiring structure design method, program, and semiconductor device production methodTOSHIBA KK·Filed 2007·Granted Apr 5, 2011·35 cites·16 claims
- 0793US6678112B1Disk drive deviceFUJITSU LTD·Filed 2000·Granted Jan 13, 2004·41 cites·14 claims
- 0893US6348402B1Method of manufacturing a copper interconnectTOSHIBA KK·Filed 2000·Granted Feb 19, 2002·87 cites·21 claims
- 0993US6071810AMethod of filling contact holes and wiring grooves of a semiconductor deviceTOSHIBA KK·Filed 1997·Granted Jun 6, 2000·101 cites·2 claims
- 1092US7414815B2Magnetic head actuator with centered deviationFUJITSU LTD·Filed 2007·Granted Aug 19, 2008·12 cites·4 claims
- 1192US6673704B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Jan 6, 2004·42 cites·26 claims
- 1291US7554762B2Recording disk drive having shroudFUJITSU LTD·Filed 2005·Granted Jun 30, 2009·13 cites·7 claims
- 1391US6306756B1Method for production of semiconductor deviceTOSHIBA KK·Filed 2000·Granted Oct 23, 2001·62 cites·10 claims
- 1491US5590001ABreather filter unit for magnetic disk driveFUJITSU LTD·Filed 1994·Granted Dec 31, 1996·52 cites·8 claims
- 1590US6727593B2Semiconductor device with improved bondingTOSHIBA KK·Filed 2002·Granted Apr 27, 2004·48 cites·9 claims
- 1689US6229211B1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 1999·Granted May 8, 2001·88 cites·19 claims
- 1789US5953634AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1996·Granted Sep 14, 1999·103 cites·22 claims
- 1887US5664989APolishing pad, polishing apparatus and polishing methodTOSHIBA KK·Filed 1996·Granted Sep 9, 1997·74 cites·30 claims
- 1986US7996813B2Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer programTOSHIBA KK·Filed 2010·Granted Aug 9, 2011·9 cites·16 claims
- 2086US7091733B2Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test methodIBIDEN CO LTD·Filed 2004·Granted Aug 15, 2006·30 cites·20 claims
- 2186US5409862AMethod for making aluminum single crystal interconnections on insulatorsTOSHIBA KK·Filed 1993·Granted Apr 25, 1995·56 cites·15 claims
- 2285US6291891B1Semiconductor device manufacturing method and semiconductor deviceTOSHIBA KK·Filed 1999·Granted Sep 18, 2001·69 cites·26 claims
- 2385US6090701AMethod for production of semiconductor deviceTOSHIBA KK·Filed 1995·Granted Jul 18, 2000·74 cites·11 claims
- 2484US7635646B2Method for fabricating semiconductor deviceTOSHIBA KK·Filed 2008·Granted Dec 22, 2009·12 cites·20 claims
- 2584US7238919B2Heating element movement bonding method for semiconductor componentsTOSHIBA KK·Filed 2006·Granted Jul 3, 2007·13 cites·13 claims
- 2684US6611060B1Semiconductor device having a damascene type wiring layerTOSHIBA KK·Filed 2000·Granted Aug 26, 2003·26 cites·10 claims
- 2784US5583720AMagnetic disk drive and flexible printed board used in such driveFUJITSU LTD·Filed 1994·Granted Dec 10, 1996·33 cites·4 claims
- 2883US6992864B2Flexible printed circuit board unit contributing to reliable soldering and suppression of increased temperatureFUJITSU LTD·Filed 2004·Granted Jan 31, 2006·29 cites·9 claims
- 2983US6579785B2Method of making multi-level wiring in a semiconductor deviceTOSHIBA KK·Filed 2001·Granted Jun 17, 2003·31 cites·16 claims
- 3082US7242206B2Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test methodIBIDEN CO LTD·Filed 2005·Granted Jul 10, 2007·7 cites·43 claims
- 3182US6913681B2Plating method and plating apparatusTOSHIBA KK·Filed 2002·Granted Jul 5, 2005·20 cites·9 claims
- 3282US6555925B1Semiconductor device and producing method thereofTOSHIBA KK·Filed 2000·Granted Apr 29, 2003·33 cites·12 claims
- 3381US6342444B1Method of forming diffusion barrier for copper interconnectsTOSHIBA KK·Filed 2000·Granted Jan 29, 2002·32 cites·18 claims
- 3480US6670714B1Semiconductor integrated circuit device having multilevel interconnectionTOSHIBA KK·Filed 2003·Granted Dec 30, 2003·22 cites·12 claims
- 3580US6403481B1Film formation methodTOSHIBA KK·Filed 1999·Granted Jun 11, 2002·55 cites·15 claims
- 3679US6407453B1Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2000·Granted Jun 18, 2002·32 cites·14 claims
- 3779US6150270AMethod for forming barrier layer for copper metallizationTOSHIBA KK·Filed 1999·Granted Nov 21, 2000·54 cites·7 claims
- 3879US5661345ASemiconductor device having a single-crystal metal wiringTOSHIBA KK·Filed 1994·Granted Aug 26, 1997·35 cites·3 claims
- 3978US6518177B1Method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2001·Granted Feb 11, 2003·23 cites·7 claims
- 4077US6552434B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2002·Granted Apr 22, 2003·18 cites·3 claims
- 4175US5798887AApparatus for absorbing stator vibrations in computer storage apparatusFUJITSU LTD·Filed 1995·Granted Aug 25, 1998·40 cites·30 claims
- 4275US5709958AElectronic partsTOSHIBA KK·Filed 1995·Granted Jan 20, 1998·48 cites·12 claims
- 4374US7675183B2Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor deviceTOSHIBA KK·Filed 2008·Granted Mar 9, 2010·4 cites·11 claims
- 4474US7575664B2Plating methodTOSHIBA KK·Filed 2005·Granted Aug 18, 2009·3 cites·7 claims
- 4574US6946387B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2003·Granted Sep 20, 2005·11 cites·2 claims
- 4674US6001461AElectronic parts and manufacturing method thereofTOSHIBA KK·Filed 1996·Granted Dec 14, 1999·44 cites·12 claims
- 4773US7531876B2Semiconductor device having power semiconductor elementsTOSHIBA KK·Filed 2005·Granted May 12, 2009·6 cites·14 claims
- 4873US5956210AStructure and jig for mounting spring arm on corresponding head armFUJITSU LTD·Filed 1997·Granted Sep 21, 1999·24 cites·7 claims
- 4972US6368951B2Semiconductor device manufacturing method and semiconductor deviceTOSHIBA KK·Filed 2001·Granted Apr 9, 2002·16 cites·4 claims
- 5071US7608537B2Method for fabricating semiconductor deviceTOSHIBA KK·Filed 2007·Granted Oct 27, 2009·3 cites·20 claims
Showing the top 50 of 107 patent records by PatentIndex Score.
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