Inventor · disambiguated record
Daniel Baudouin
Also filed as: BAUDOUIN DANIEL · BAUDOUIN DANIEL A · BAUDOUIN DANIEL ADRIAN
15 granted patents·878 citations·filing 1974–1999
95Inventor score
Files withTEXAS INSTRUMENTS INC15
Top patents by PatentIndex Score
15 records- 0195US6373127B1Integrated capacitor on the back of a chipTEXAS INSTRUMENTS INC·Filed 1999·Granted Apr 16, 2002·229 cites·10 claims
- 0291US5483024AHigh density semiconductor packageTEXAS INSTRUMENTS INC·Filed 1993·Granted Jan 9, 1996·120 cites·6 claims
- 0391US5208732AMemory card with flexible conductor between substrate and metal coverTEXAS INSTRUMENTS INC·Filed 1991·Granted May 4, 1993·102 cites·7 claims
- 0489US4975763AEdge-mounted, surface-mount package for semiconductor integrated circuit devicesTEXAS INSTRUMENTS INC·Filed 1988·Granted Dec 4, 1990·86 cites·16 claims
- 0582US4994938AMounting of high density components on substrateTEXAS INSTRUMENTS INC·Filed 1988·Granted Feb 19, 1991·33 cites·12 claims
- 0678US5432678AHigh power dissipation vertical mounted package for surface mount applicationTEXAS INSTRUMENTS INC·Filed 1994·Granted Jul 11, 1995·44 cites·13 claims
- 0775US5637828AHigh density semiconductor packageTEXAS INSTRUMENTS INC·Filed 1995·Granted Jun 10, 1997·43 cites·14 claims
- 0875US5352851AEdge-mounted, surface-mount integrated circuit deviceTEXAS INSTRUMENTS INC·Filed 1992·Granted Oct 4, 1994·57 cites·22 claims
- 0971US6040983AVertical passive components for surface mount assemblyTEXAS INSTRUMENTS INC·Filed 1998·Granted Mar 21, 2000·40 cites·4 claims
- 1070US5260601AEdge-mounted, surface-mount package for semiconductor integrated circuit devicesTEXAS INSTRUMENTS INC·Filed 1990·Granted Nov 9, 1993·37 cites·20 claims
- 1165US5414253AIntegrated circuit cardTEXAS INSTRUMENTS INC·Filed 1994·Granted May 9, 1995·35 cites·10 claims
- 1253US5387814AIntegrated circuit with supports for mounting an electrical componentTEXAS INSTRUMENTS INC·Filed 1993·Granted Feb 7, 1995·24 cites·7 claims
- 1345US5671125AVertical package mounted on both sides of a printed circuit boardTEXAS INSTRUMENTS INC·Filed 1995·Granted Sep 23, 1997·13 cites·11 claims
- 1440US5275975AMethod of making a relatively flat semiconductor package having a semiconductor chip encapsulated in molded materialTEXAS INSTRUMENTS INC·Filed 1992·Granted Jan 4, 1994·9 cites·13 claims
- 1534US3970995ASlaving calculator chipsTEXAS INSTRUMENTS INC·Filed 1974·Granted Jul 20, 1976·6 cites·7 claims
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