Inventor · disambiguated record
Carlos Dangelo
Also filed as: DANGELO CARLOS
36 granted patents·6 pending applications·5,390 citations·filing 1990–2009
99Inventor score
Top patents by PatentIndex Score
42 records- 0199US5544067AMethod and system for creating, deriving and validating structural description of electronic system from higher level, behavior-oriented description, including interactive schematic design and simulationLSI LOGIC CORP·Filed 1993·Granted Aug 6, 1996·355 cites·31 claims
- 0298US5801958AMethod and system for creating and validating low level description of electronic design from higher level, behavior-oriented description, including interactive system for hierarchical display of control and dataflow informationLSI LOGIC CORP·Filed 1996·Granted Sep 1, 1998·471 cites·40 claims
- 0398US5555201AMethod and system for creating and validating low level description of electronic design from higher level, behavior-oriented description, including interactive system for hierarchical display of control and dataflow informationLSI LOGIC CORP·Filed 1994·Granted Sep 10, 1996·356 cites·24 claims
- 0498US5541849AMethod and system for creating and validating low level description of electronic design from higher level, behavior-oriented description, including estimation and comparison of timing parametersLSI LOGIC CORP·Filed 1993·Granted Jul 30, 1996·250 cites·8 claims
- 0597US5946487AObject-oriented multi-media architectureLSI LOGIC CORP·Filed 1996·Granted Aug 31, 1999·352 cites·20 claims
- 0697US5838163ATesting and exercising individual, unsingulated dies on a waferLSI LOGIC CORP·Filed 1995·Granted Nov 17, 1998·137 cites·7 claims
- 0797US5572437AMethod and system for creating and verifying structural logic model of electronic design from behavioral description, including generation of logic and timing modelsLSI LOGIC CORP·Filed 1994·Granted Nov 5, 1996·149 cites·17 claims
- 0897US5442282ATesting and exercising individual, unsingulated dies on a waferLSI LOGIC CORP·Filed 1992·Granted Aug 15, 1995·150 cites·3 claims
- 0996US6470482B1Method and system for creating, deriving and validating structural description of electronic system from higher level, behavior-oriented description, including interactive schematic design and simulationLSI LOGIC CORP·Filed 1996·Granted Oct 22, 2002·253 cites·23 claims
- 1096US5933356AMethod and system for creating and verifying structural logic model of electronic design from behavioral description, including generation of logic and timing modelsLSI LOGIC CORP·Filed 1996·Granted Aug 3, 1999·263 cites·13 claims
- 1196US5553002AMethod and system for creating and validating low level description of electronic design from higher level, behavior-oriented description, using milestone matrix incorporated into user-interfaceLSI LOGIC CORP·Filed 1993·Granted Sep 3, 1996·139 cites·23 claims
- 1295US6324678B1Method and system for creating and validating low level description of electronic designLSI LOGIC CORP·Filed 1996·Granted Nov 27, 2001·264 cites·23 claims
- 1395US6216252B1Method and system for creating, validating, and scaling structural description of electronic deviceLSI LOGIC CORP·Filed 1996·Granted Apr 10, 2001·337 cites·21 claims
- 1495US5539325ATesting and exercising individual, unsingulated dies on a waferLSI LOGIC CORP·Filed 1995·Granted Jul 23, 1996·100 cites·20 claims
- 1594US7109581B2System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-coolerNANOCONDUCTION INC·Filed 2004·Granted Sep 19, 2006·111 cites·24 claims
- 1693US7784531B1Nanoengineered thermal materials based on carbon nanotube array compositesNASA·Filed 2007·Granted Aug 31, 2010·24 cites·13 claims
- 1793US7656027B2In-chip structures and methods for removing heat from integrated circuitsNANOCONDUCTION INC·Filed 2006·Granted Feb 2, 2010·47 cites·17 claims
- 1893US5544066AMethod and system for creating and validating low level description of electronic design from higher level, behavior-oriented description, including estimation and comparison of low-level design constraintsLSI LOGIC CORP·Filed 1993·Granted Aug 6, 1996·107 cites·24 claims
- 1993US5389556AIndividually powering-up unsingulated dies on a waferLSI LOGIC CORP·Filed 1992·Granted Feb 14, 1995·148 cites·7 claims
- 2092US5493508ASpecification and design of complex digital systemsLSI LOGIC CORP·Filed 1994·Granted Feb 20, 1996·151 cites·4 claims
- 2191US5870308AMethod and system for creating and validating low-level description of electronic designLSI LOGIC CORP·Filed 1996·Granted Feb 9, 1999·212 cites·37 claims
- 2291US5648661AIntegrated circuit wafer comprising unsingulated dies, and decoder arrangement for individually testing the diesLSI LOGIC CORP·Filed 1994·Granted Jul 15, 1997·134 cites·10 claims
- 2391US5557531AMethod and system for creating and validating low level structural description of electronic design from higher level, behavior-oriented description, including estimating power dissipation of physical implementationLSI LOGIC CORP·Filed 1993·Granted Sep 17, 1996·81 cites·35 claims
- 2490US5665989AProgrammable microsystems in siliconLSI LOGIC·Filed 1995·Granted Sep 9, 1997·117 cites·19 claims
- 2590US5222030AMethodology for deriving executable low-level structural descriptions and valid physical implementations of circuits and systems from high-level semantic specifications and descriptions thereofLSI LOGIC CORP·Filed 1990·Granted Jun 22, 1993·130 cites·23 claims
- 2689US7732918B2Vapor chamber heat sink having a carbon nanotube fluid interfaceNANOCONDUCTION INC·Filed 2007·Granted Jun 8, 2010·29 cites·32 claims
- 2789US7538422B2Integrated circuit micro-cooler having multi-layers of tubes of a CNT arrayNANOCONDUCTION INC·Filed 2006·Granted May 26, 2009·37 cites·8 claims
- 2888US5615126AHigh-speed internal interconnection technique for integrated circuits that reduces the number of signal lines through multiplexingLSI LOGIC CORP·Filed 1994·Granted Mar 25, 1997·45 cites·22 claims
- 2988US5572436AMethod and system for creating and validating low level description of electronic designLSI LOGIC CORP·Filed 1994·Granted Nov 5, 1996·77 cites·19 claims
- 3087US5598344AMethod and system for creating, validating, and scaling structural description of electronic deviceLSI LOGIC CORP·Filed 1994·Granted Jan 28, 1997·120 cites·19 claims
- 3185US5910897ASpecification and design of complex digital systemsLSI LOGIC CORP·Filed 1997·Granted Jun 8, 1999·107 cites·20 claims
- 3285US5526277AECAD system for deriving executable low-level structural descriptions and valid physical implementations of circuits and systems from high-level semantic descriptions thereofLSI LOGIC CORP·Filed 1994·Granted Jun 11, 1996·44 cites·24 claims
- 3375US8039953B2System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-coolerSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 18, 2011·11 cites·15 claims
- 3473US5880971AMethodology for deriving executable low-level structural descriptions and valid physical implementations of circuits and systems from semantic specifications and descriptions thereofLSI LOGIC CORP·Filed 1997·Granted Mar 9, 1999·53 cites·58 claims
- 3567US8080871B2Carbon nanotube-based structures and methods for removing heat from solid-state devicesDANGELO CARLOS·Filed 2008·Granted Dec 20, 2011·7 cites·22 claims
- 3652US5898677AIntegrated circuit device having a switched routing networkLSI LOGIC CORP·Filed 1997·Granted Apr 27, 1999·22 cites·2 claims
- 3742US2009302295A1Structures & Methods for Combining Carbon Nanotube Array and Organic Materials as a Variable Gap Interposer for Removing Heat from Solid-State DevicesSCHWARTZ PETER·Filed 2009·Application pending·0 cites
- 3840US2007097648A1Method and apparatus for establishing optimal thermal contact between opposing surfacesXU KEVIN·Filed 2005·Application pending·0 cites
- 3939US2007126116A1Integrated Circuit Micro-Cooler Having Tubes of a CNT Array in Essentially the Same Height over a SurfaceDANGELO CARLOS·Filed 2006·Application pending·0 cites
- 4039US2004152240A1Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuitsFiled 2004·Application pending·0 cites
- 4139US2007114658A1Integrated Circuit Micro-Cooler with Double-Sided Tubes of a CNT ArrayDANGELO CARLOS·Filed 2006·Application pending·0 cites
- 4238US2006231237A1Apparatus and method for cooling ICs using nano-rod based chip-level heat sinksDANGELO CARLOS·Filed 2006·Application pending·0 cites
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