Inventor · disambiguated record
Carlo Tiongson
Also filed as: TIONGSON CARLO · TIONGSON CARLO C
2 granted patents·2 pending applications·13 citations·filing 2002–2014
57Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0184US8723308B2Packages and methods for packaging using a lid having multiple conductive layersYANG JICHENG·Filed 2011·Granted May 13, 2014·10 cites·20 claims
- 0272US9142470B2Packages and methods for packagingANALOG DEVICES INC·Filed 2014·Granted Sep 22, 2015·3 cites·20 claims
- 0332US2005056871A1Semiconductor dice with edge cavitiesFiled 2004·Application pending·0 cites
- 0429US2004026768A1Semiconductor dice with edge cavitiesFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →