Inventor · disambiguated record
Ryo Takatsuki
Also filed as: TAKATSUKI RYO
5 granted patents·288 citations·filing 1993–2011
83Inventor score
Top patents by PatentIndex Score
5 records- 0186US5545922ADual sided integrated circuit chip package with offset wire bonds and support block cavitiesINTEL CORP·Filed 1995·Granted Aug 13, 1996·92 cites·3 claims
- 0286US5366933AMethod for constructing a dual sided, wire bonded integrated circuit chip packageINTEL CORP·Filed 1993·Granted Nov 22, 1994·120 cites·19 claims
- 0383US5527740AManufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavitiesINTEL CORP·Filed 1994·Granted Jun 18, 1996·74 cites·25 claims
- 0461US8076179B2Fabrication method for integrated circuit chip component, multi-chip module, and their integration structureTAKATSUKI RYO·Filed 2011·Granted Dec 13, 2011·2 cites·4 claims
- 0541US7977801B2Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication methodTAKATSUKI RYO·Filed 2006·Granted Jul 12, 2011·0 cites·8 claims
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