Inventor · disambiguated record
Wataru Iwazaki
Also filed as: IWAZAKI WATARU
5 granted patents·13 pending applications·6 citations·filing 2006–2022
67Inventor score
Top patents by PatentIndex Score
18 records- 0171US12479270B2Heat medium temperature adjustment systemSANDEN CORP·Filed 2022·Granted Nov 25, 2025·0 cites·11 claims
- 0268US10420223B2Method for manufacturing substrate for power module with heat sinkMITSUBISHI MATERIALS CORP·Filed 2016·Granted Sep 17, 2019·2 cites·6 claims
- 0366US7499440B2Communication system, network router and network connection methodSANDEN CORP·Filed 2006·Granted Mar 3, 2009·4 cites·12 claims
- 0460US2020111722A1Method for producing ceramic-aluminum bonded body, method for producing power module substrate, ceramic-aluminum bonded body, and power module substrateMITSUBISHI MATERIALS CORP·Filed 2019·Application pending·0 cites
- 0556US2024399825A1Vehicle heat management systemSANDEN CORP·Filed 2022·Application pending·0 cites
- 0649US2010279632A1Communication apparatusSANDEN CORP·Filed 2008·Application pending·0 cites
- 0748US10573577B2Method for producing ceramic-aluminum bonded body, method for producing power module substrate, ceramic-aluminum bonded body, and power module substrateMITSUBISHI MATERIALS CORP·Filed 2015·Granted Feb 25, 2020·0 cites·5 claims
- 0842US2008019096A1Communication DeviceSANDEN CORP·Filed 2007·Application pending·0 cites
- 0941US7599387B2DCE to DTE connection adapter for communication deviceSANDEN CORP·Filed 2006·Granted Oct 6, 2009·0 cites·6 claims
- 1038US2008020604A1Communication DeviceSANDEN CORP·Filed 2007·Application pending·0 cites
- 1138US2007248107A1Connection Adapter for Communication DeviceSANDEN CORP·Filed 2007·Application pending·0 cites
- 1238US2009219949A1Connection adapter for communication deviceSANDEN CORP·Filed 2007·Application pending·0 cites
- 1338US2007274254A1Connection adapter for communication deviceSANDEN CORP·Filed 2007·Application pending·0 cites
- 1438US2007268921A1Connection Adapter for Communication DeviceSANDEN CORP·Filed 2007·Application pending·0 cites
- 1537US2010165848A1Connection adapter for communication deviceSANDEN CORP·Filed 2008·Application pending·0 cites
- 1635US2019058101A1Thermoelectric conversion module and thermoelectric conversion deviceMITSUBISHI MATERIALS CORP·Filed 2016·Application pending·0 cites
- 1733US2018277729A1Light-emitting module substrate, light-emitting module, substrate for light-emitting module having cooler, and production method for light-emitting module substrateMITSUBISHI MATERIALS CORP·Filed 2016·Application pending·0 cites
- 1833US2018277730A1Light-emission module having cooler and production method for light-emission module having coolerMITSUBISHI MATERIALS CORP·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →