Inventor · disambiguated record
Hoon Seok Seo
Also filed as: SEO HOON SEOK
13 granted patents·2 pending applications·15 citations·filing 2017–2023
86Inventor score
Files withSAMSUNG ELECTRONICS CO LTD15
Top patents by PatentIndex Score
15 records- 0196US11569128B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·3 cites·20 claims
- 0286US10276505B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 30, 2019·5 cites·20 claims
- 0384US12243777B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 0479US11823952B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 0579US11037872B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 15, 2021·2 cites·19 claims
- 0679US10497649B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 3, 2019·2 cites·15 claims
- 0776US10943824B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 9, 2021·1 cites·20 claims
- 0874US10535600B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·19 claims
- 0969US11600569B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 1061US11876017B2Integrated circuit devices including enlarged via and fully aligned metal wire and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·19 claims
- 1160US11049810B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 29, 2021·0 cites·20 claims
- 1257US2024204107A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1356US11232986B2Integrated circuit devices including enlarged via and fully aligned metal wire and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 25, 2022·0 cites·18 claims
- 1452US2024145345A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1543US10916437B2Methods of forming micropatterns and substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 9, 2021·0 cites·19 claims
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