Inventor · disambiguated record
Robin Wilson
Also filed as: WILSON ROBIN · WILSON ROBIN M
30 granted patents·4 pending applications·341 citations·filing 2000–2014
96Inventor score
Files withICEMOS TECHNOLOGY LTD19WILSON ROBIN6ICEMOS TECHNOLOGY CORP5ERICSSON TELEFON AB L M2KOHLI NISHU1
Top patents by PatentIndex Score
34 records- 0196US6326859B1Oscillator circuit having trimmable capacitor array receiving a reference currentERICSSON TELEFON AB L M·Filed 2000·Granted Dec 4, 2001·153 cites·4 claims
- 0294US7576404B2Backlit photodiode and method of manufacturing a backlit photodiodeICEMOS TECHNOLOGY LTD·Filed 2006·Granted Aug 18, 2009·28 cites·4 claims
- 0393US7446018B2Bonded-wafer superjunction semiconductor deviceICEMOS TECHNOLOGY CORP·Filed 2006·Granted Nov 4, 2008·33 cites·18 claims
- 0490US7560791B2Front lit PIN/NIP diode having a continuous anode/cathodeICEMOS TECHNOLOGY LTD·Filed 2006·Granted Jul 14, 2009·13 cites·7 claims
- 0589US7972934B2Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodesICEMOS TECHNOLOGY LTD·Filed 2008·Granted Jul 5, 2011·10 cites·14 claims
- 0688US7601556B2Front side electrical contact for photodetector array and method of making sameICEMOS TECHNOLOGY LTD·Filed 2008·Granted Oct 13, 2009·10 cites·8 claims
- 0787US7553764B2Silicon wafer having through-wafer viasICEMOS TECHNOLOGY LTD·Filed 2006·Granted Jun 30, 2009·14 cites·11 claims
- 0885US7528458B2Photodiode having increased proportion of light-sensitive area to light-insensitive areaICEMOS TECHNOLOGY LTD·Filed 2007·Granted May 5, 2009·7 cites·13 claims
- 0982US7741141B2Photodiode having increased proportion of light-sensitive area to light-insensitive areaICEMOS TECHNOLOGY LTD·Filed 2009·Granted Jun 22, 2010·5 cites·7 claims
- 1082US7429772B2Technique for stable processing of thin/fragile substratesICEMOS TECHNOLOGY CORP·Filed 2006·Granted Sep 30, 2008·6 cites·9 claims
- 1180US7768085B2Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodesICEMOS TECHNOLOGY LTD·Filed 2006·Granted Aug 3, 2010·4 cites·7 claims
- 1278US7579667B2Bonded-wafer superjunction semiconductor deviceICEMOS TECHNOLOGY LTD·Filed 2008·Granted Aug 25, 2009·7 cites·6 claims
- 1377USD609285SStuffed toy with fact memory chipWILSON ROBIN·Filed 2009·Granted Feb 2, 2010·26 cites·1 claims
- 1472US8058091B2Front lit PIN/NIP diode having a continuous anode/cathodeWILSON ROBIN·Filed 2008·Granted Nov 15, 2011·2 cites·10 claims
- 1568US7489014B2Front side electrical contact for photodetector array and method of making sameICEMOS TECHNOLOGY LTD·Filed 2007·Granted Feb 10, 2009·1 cites·12 claims
- 1667US7579273B2Method of manufacturing a photodiode array with through-wafer viasICEMOS TECHNOLOGY LTD·Filed 2007·Granted Aug 25, 2009·3 cites·21 claims
- 1765US7439178B2Technique for stable processing of thin/fragile substratesICEMOS TECHNOLOGY CORP·Filed 2007·Granted Oct 21, 2008·1 cites·11 claims
- 1863US8030133B2Method of fabricating a bonded wafer substrate for use in MEMS structuresICEMOS TECHNOLOGY LTD·Filed 2009·Granted Oct 4, 2011·2 cites·10 claims
- 1962US8730756B2Dual clock edge triggered memoryKOHLI NISHU·Filed 2011·Granted May 20, 2014·2 cites·28 claims
- 2061US7821089B2Photodetector array using isolation diffusions as crosstalk inhibitors between adjacent photodiodesICEMOS TECHNOLOGY LTD·Filed 2008·Granted Oct 26, 2010·0 cites·16 claims
- 2158US7999348B2Technique for stable processing of thin/fragile substratesICEMOS TECHNOLOGY LTD·Filed 2008·Granted Aug 16, 2011·0 cites·10 claims
- 2257US8913457B2Dual clock edge triggered memoryST MICROELECTRONICS INT NV·Filed 2014·Granted Dec 16, 2014·1 cites·26 claims
- 2355US8294508B2Method and device for driving the frequency of a clock signal of an integrated circuitWILSON ROBIN·Filed 2011·Granted Oct 23, 2012·1 cites·22 claims
- 2454US7910479B2Method of manufacturing a photodiode array with through-wafer viasICEMOS TECHNOLOGY LTD·Filed 2009·Granted Mar 22, 2011·0 cites·19 claims
- 2554US6310510B1Electronic circuit for producing a reference current independent of temperature and supply voltageERICSSON TELEFON AB L M·Filed 2000·Granted Oct 30, 2001·10 cites·4 claims
- 2653US8148203B2Technique for stable processing of thin/fragile substratesWILSON ROBIN·Filed 2011·Granted Apr 3, 2012·0 cites·14 claims
- 2752US2009253261A1Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric ShapeICEMOS TECHNOLOGY LTD·Filed 2009·Application pending·0 cites
- 2849US8253243B2Bonded wafer substrate utilizing roughened surfaces for use in MEMS structuresWILSON ROBIN·Filed 2011·Granted Aug 28, 2012·0 cites·5 claims
- 2948US7741172B2Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diodeICEMOS TECHNOLOGY LTD·Filed 2006·Granted Jun 22, 2010·2 cites·17 claims
- 3048US2008099924A1Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric ShapeICEMOS TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 3147US7709950B2Silicon wafer having through-wafer viasICEMOS TECHNOLOGY LTD·Filed 2008·Granted May 4, 2010·0 cites·6 claims
- 3243US2008122040A1Varying Pitch Adapter and a Method of Forming a Varying Pitch AdapterICEMOS TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 3338US8169057B2Positive-intrinsic-negative (PIN)/negative-intrinsic-positive (NIP) diodeWILSON ROBIN·Filed 2008·Granted May 1, 2012·0 cites·9 claims
- 3437US2011042576A1Direct wafer-bonded through-hole photodiodeICEMOS TECHNOLOGY LTD·Filed 2010·Application pending·0 cites
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