Inventor · disambiguated record
Noriko Murakami
Also filed as: MURAKAMI NORIKO
4 granted patents·130 citations·filing 1996–2002
81Inventor score
Technology areasH10W
Files withOKI ELECTRIC IND CO LTD4
Top patents by PatentIndex Score
4 records- 0183US5864174ASemiconductor device having a die pad structure for preventing cracks in a molding resinOKI ELECTRIC IND CO LTD·Filed 1996·Granted Jan 26, 1999·53 cites·6 claims
- 0281US6177725B1Semiconductor device having an improved structure for preventing cracks, improved small-sized semiconductor and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 1998·Granted Jan 23, 2001·48 cites·13 claims
- 0374US6569755B2Semiconductor device having an improved structure for preventing cracks, improved small sized semiconductor and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 2002·Granted May 27, 2003·16 cites·3 claims
- 0471US6459145B1Semiconductor device having an improved structure for preventing cracks, and improved small-sized semiconductorOKI ELECTRIC IND CO LTD·Filed 2000·Granted Oct 1, 2002·13 cites·16 claims
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