Inventor · disambiguated record
Sabina J. Houle
Also filed as: HOULE SABINA · HOULE SABINA J
44 granted patents·17 pending applications·973 citations·filing 1993–2015
98Inventor score
Top patents by PatentIndex Score
61 records- 0194US6504242B1Electronic assembly having a wetting layer on a thermally conductive heat spreaderINTEL CORP·Filed 2001·Granted Jan 7, 2003·128 cites·31 claims
- 0293US6987671B2Composite thermal interface devices and methods for integrated circuit heat transferINTEL CORP·Filed 2003·Granted Jan 17, 2006·54 cites·27 claims
- 0393US6469381B1Carbon-carbon and/or metal-carbon fiber composite heat spreaderINTEL CORP·Filed 2000·Granted Oct 22, 2002·73 cites·17 claims
- 0492US7014093B2Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making sameINTEL CORP·Filed 2003·Granted Mar 21, 2006·41 cites·24 claims
- 0592US6748350B2Method to compensate for stress between heat spreader and thermal interface materialINTEL CORP·Filed 2001·Granted Jun 8, 2004·61 cites·12 claims
- 0691US5544458AVehicle panel assemblyDONNELLY CORP·Filed 1993·Granted Aug 13, 1996·54 cites·75 claims
- 0790US7019971B2Thermal management systems for micro-componentsINTEL CORP·Filed 2003·Granted Mar 28, 2006·53 cites·15 claims
- 0888US6867978B2Integrated heat spreader package for heat transfer and for bond line thickness control and process of makingINTEL CORP·Filed 2002·Granted Mar 15, 2005·65 cites·14 claims
- 0986US7821126B2Heat sink with preattached thermal interface material and method of making sameINTEL CORP·Filed 2008·Granted Oct 26, 2010·11 cites·12 claims
- 1086US6837306B2Carbon-carbon and/or metal-carbon fiber composite heat spreadersINTEL CORP·Filed 2001·Granted Jan 4, 2005·33 cites·5 claims
- 1185US7473995B2Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assemblyINTEL CORP·Filed 2002·Granted Jan 6, 2009·39 cites·12 claims
- 1285US6882535B2Integrated heat spreader with downset edge, and method of making sameINTEL CORP·Filed 2003·Granted Apr 19, 2005·41 cites·30 claims
- 1384US7723160B2Thermal interface structure with integrated liquid cooling and methodsINTEL CORP·Filed 2006·Granted May 25, 2010·9 cites·17 claims
- 1483US7327027B2Thermal interface structure with integrated liquid cooling and methodsINTEL CORP·Filed 2006·Granted Feb 5, 2008·8 cites·24 claims
- 1583US7190585B2Thermal heat spreaders designed for lower cost manufacturability, lower mass and increased thermal performanceINTEL CORP·Filed 2003·Granted Mar 13, 2007·33 cites·7 claims
- 1683US7030485B2Thermal interface structure with integrated liquid cooling and methodsINTEL CORP·Filed 2003·Granted Apr 18, 2006·26 cites·9 claims
- 1783US6773963B2Apparatus and method for containing excess thermal interface materialINTEL CORP·Filed 2002·Granted Aug 10, 2004·34 cites·26 claims
- 1882US7304381B2Package and method for attaching an integrated heat spreaderINTEL CORP·Filed 2006·Granted Dec 4, 2007·12 cites·25 claims
- 1980US7588968B1Linked chip attach and underfillINTEL CORP·Filed 2008·Granted Sep 15, 2009·9 cites·9 claims
- 2080US7527090B2Heat dissipating device with preselected designed interface for thermal interface materialsINTEL CORP·Filed 2003·Granted May 5, 2009·24 cites·13 claims
- 2180US7195951B2Carbon-carbon and/or metal-carbon fiber composite heat spreadersINTEL CORP·Filed 2004·Granted Mar 27, 2007·21 cites·6 claims
- 2279US7629203B2Thermal interface material for combined reflowINTEL CORP·Filed 2008·Granted Dec 8, 2009·5 cites·22 claims
- 2378US8987894B2Underfill process and materials for singulated heat spreader stiffener for thin core panel processingINTEL CORP·Filed 2014·Granted Mar 24, 2015·3 cites·17 claims
- 2477US7846778B2Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assemblyINTEL CORP·Filed 2002·Granted Dec 7, 2010·24 cites·7 claims
- 2577US7015073B2Method of forming heat spreader with down set leg attachment featureINTEL CORP·Filed 2004·Granted Mar 21, 2006·22 cites·21 claims
- 2676US7534650B2Carbon-carbon and/or metal-carbon fiber composite heat spreaderINTEL CORP·Filed 2006·Granted May 19, 2009·5 cites·11 claims
- 2775US9142480B2Microelectronic package with high temperature thermal interface materialHOULE SABINA·Filed 2008·Granted Sep 22, 2015·8 cites·2 claims
- 2874US7218000B2Liquid solder thermal interface material contained within a cold-formed barrier and methods of making sameINTEL CORP·Filed 2003·Granted May 15, 2007·20 cites·19 claims
- 2974US7183140B2Injection molded metal bonding tray for integrated circuit device fabricationINTEL CORP·Filed 2004·Granted Feb 27, 2007·16 cites·13 claims
- 3072US7996989B2Heat dissipating device with preselected designed interface for thermal interface materialsINTEL CORP·Filed 2008·Granted Aug 16, 2011·4 cites·3 claims
- 3170US8765528B2Underfill process and materials for singulated heat spreader stiffener for thin core panel processingHOULE SABINA J·Filed 2013·Granted Jul 1, 2014·2 cites·7 claims
- 3269US8390112B2Underfill process and materials for singulated heat spreader stiffener for thin core panel processingHOULE SABINA J·Filed 2008·Granted Mar 5, 2013·3 cites·12 claims
- 3369US8067256B2Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the methodHOULE SABINA J·Filed 2007·Granted Nov 29, 2011·4 cites·10 claims
- 3469US7644871B2Flux spray atomization and splash controlINTEL CORP·Filed 2006·Granted Jan 12, 2010·4 cites·16 claims
- 3566US7654433B2Flux overspray removal masks with channels, methods of assembling same, and systems containing sameINTEL CORP·Filed 2006·Granted Feb 2, 2010·2 cites·28 claims
- 3661US6756669B2Heat spreader with down set leg attachment featureINTEL CORP·Filed 2002·Granted Jun 29, 2004·9 cites·20 claims
- 3760US7416922B2Heat sink with preattached thermal interface material and method of making sameINTEL CORP·Filed 2003·Granted Aug 26, 2008·7 cites·27 claims
- 3858US7358606B2Apparatus to compensate for stress between heat spreader and thermal interface materialINTEL CORP·Filed 2004·Granted Apr 15, 2008·6 cites·15 claims
- 3954US2006124700A1Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making sameINTEL CORP·Filed 2006·Application pending·0 cites
- 4050US2009293266A1Linked Chip Attach And UnderfillZARBOCK EDWARD A·Filed 2009·Application pending·0 cites
- 4150US2016043014A1Underfill process and materials for singulated heat spreader stiffener for thin core panel processingINTEL CORP·Filed 2015·Application pending·0 cites
- 4249US9180541B2Rotational-flow spray nozzle and process of using sameRAMANAN HARIKRISHNAN·Filed 2012·Granted Nov 10, 2015·0 cites·19 claims
- 4349US8013439B2Injection molded metal stiffener for packaging applicationsINTEL CORP·Filed 2008·Granted Sep 6, 2011·0 cites·14 claims
- 4447US8215536B2Rotational-flow spray nozzle and process of using sameRAMANAN HARIKRISHNAN·Filed 2006·Granted Jul 10, 2012·0 cites·20 claims
- 4547US7421780B2Methods for fabricating thermal management systems for micro-componentsINTEL CORP·Filed 2006·Granted Sep 9, 2008·0 cites·8 claims
- 4646US2009321925A1Injection molded metal ic package stiffener and package-to-package interconnect frameGEALER CHARLES A·Filed 2008·Application pending·0 cites
- 4745US2009321955A1Securing integrated circuit dice to substratesHOULE SABINA·Filed 2008·Application pending·0 cites
- 4845US2008156895A1Flux overspray reduction apparatus, systems, and methodsMELLODY JAMES P·Filed 2006·Application pending·0 cites
- 4944US2009243085A1Apparatus and method for attaching a heat dissipating deviceHOULE SABINA J·Filed 2008·Application pending·0 cites
- 5044US2005212123A1Integrated heat spreader with downset edge, and method of making sameINTEL CORP·Filed 2005·Application pending·0 cites
Showing the top 50 of 61 patent records by PatentIndex Score.
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